Manufacturer | Part # | Datasheet | Description |
Bourns Electronic Solut...
|
CI160808 |
218Kb/2P |
Multi-Layer Chip Inductors |
WALSIN TECHNOLOGY CORPO...
|
WLFM160808 |
1Mb/8P |
Multi-Layer Power Inductors |
Samsung semiconductor
|
CL10B103KB8NNNC |
1Mb/36P |
Multi-layer Ceramic Capacitor |
CL21A226MAQNNNE |
810Kb/3P |
Multi-layer Ceramic Capacitor |
CL10A106MQ8NNNC |
147Kb/2P |
Multi-layer Ceramic Capacitor |
CL21B106KPQNNNE |
319Kb/3P |
Multi-layer Ceramic Capacitor |
CL31B106KAHNNNE |
1Mb/36P |
Multi-layer Ceramic Capacitor |
Taiyo Yuden (U.S.A.), I...
|
MAASE063SB7332KFCA01 |
147Kb/1P |
Multi Layer Ceramic Capacitor |
Samsung semiconductor
|
CL10A106MO8NQNC |
78Kb/2P |
Multi-layer Ceramic Capacitor |
Abracon Corporation
|
ADFC21 |
137Kb/2P |
MULTI-LAYER DIELECTRIC FILTER 06.22.07 |
ATMEL Corporation
|
AT78C5081 |
129Kb/3P |
Serial ATA Physical Layer |
Bourns Electronic Solut...
|
CI201210 |
751Kb/2P |
Multi-Layer Chip Inductors |
Murata Manufacturing Co...
|
JECXDE-0015 |
441Kb/16P |
Electrical Double Layer Capacitor |
List of Unclassifed Man...
|
DVLSERIES |
177Kb/2P |
Electrical Double Layer Capacitor |
Fair-Rite Products Corp...
|
2506031217H0 |
315Kb/3P |
MULTI-LAYER CHIP BEAD |
2506031517Y0 |
297Kb/3P |
MULTI-LAYER CHIP BEAD |
2506033017Y0 |
297Kb/3P |
MULTI-LAYER CHIP BEAD |
2508053017Z0 |
288Kb/3P |
MULTI-LAYER CHIP BEAD |
2508056017Y0 |
298Kb/3P |
MULTI-LAYER CHIP BEAD |
2504026007Y0 |
293Kb/3P |
MULTI-LAYER CHIP BEAD |