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MINIMUM Datasheet, PDF

Search Description : 'MINIMUM' - Total: 200 (1/10) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

Molex Electronics Ltd.
0759001322 3.50mm (.138") Pitch, MX150™ Dual Row Header, Breakaway, Right Angle, 2 Circuits1.25μm (50μ") Nickel (Ni) Overall, 2.50μm (100μ") Minimum Select Matte Tin (Sn)Plating on Tail, 0.75μm Minimum Select Gold (Au) Contact Area, 4.75mm (.187") PC
0759001301 3.50mm (.138") Pitch, MX150™ Dual Row Header, Breakaway, Right Angle, 20Circuits, 1.25μm (50μ") Nickel (Ni) Overall, 2.50μm (100μ") Minimum Select Matte TinSn) Plating on Tail, 0.75μm Minimum Select Gold (Au) Contact Area, 3.05mm (.120")
0759001281 3.50mm (.138") Pitch, MX150™ Dual Row Header, Breakaway, Right Angle, 16Circuits, 1.25μm (50μ") Nickel (Ni) Overall, 2.50μm (100μ") Minimum Select Matte Tin(Sn) Plating on Tail, 0.05μm Minimum Select Gold (Au) Contact Area, 3.05mm (.120")
0757570232 3.50mm (.138") Pitch, MX150™ Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ")Nickel (Ni) Overall, 2.50μm (100μ") Minimum Select Matte Tin (Sn) Plating on Tail0.05μm Minimum Select Gold (Au) Contact Area, 11.20mm (.440") Mating Pin
0713085470 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 70 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
0757570361 3.50mm (.138") Pitch, MX150™ Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ") Nickel (Ni) Overall, 2.50μm (100μ") Minimum Select Matte Tin (Sn) Plating on Tail

Linear Technology
LTC3588-2_10 Piezoelectric Energy Harvesting Power Supply with 14V Minimum VIN

List of Unclassifed Man...
AT25DF041A_13 Minimum SPI Serial Flash Memory
AT45DB041E 4-Mbit DataFlash (with Extra 128-Kbits), 1.65V Minimum SPI Serial Flash Memory

Future Technology Devic...
UC232R “ChiPi” Minimum Component FT232RL USB to RS232 Converter Cable

Molex Electronics Ltd.
0713085404 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs
0713086470 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 70 Circuits 1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130")
0713086454 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 54 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130")
0757576221 3.50mm (.138") Pitch, MX150™ Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ")Nickel (Ni) Overall, 2.50μm (100μ") Minimum Select Matte Tin (Sn) Plating on Tail,
0757570341 3.50mm (.138") Pitch, MX150™ Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ") Nickel (Ni) Overall, 2.50μm (100μ") Minimum Select Matte Tin (Sn) Plating on Tail
0757570441 3.50mm (.138) Pitch, MX150™ Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall

List of Unclassifed Man...
AT25DQ161_13 Minimum SPI Serial Flash Memory with Dual-I/O and Quad-I/O Support

Molex Electronics Ltd.
0759001262 3.50mm (.138") Pitch, MX150™ Dual Row Header, Breakaway, Right Angle, 12Circuits, 1.25μm (50μ") Nickel (Ni) Overall, 2.50μm (100μ") Minimum Select Matte Tin

NEC
LD7246A 14 GHz, 123 W CW, CONDUCTION COOLING, MINIMUM SIZE

ATMEL Corporation
AT25DF041A_08 4-megabit 2.3-volt or 2.7-volt Minimum SPI Serial Flash Memory

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