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PACKAGE Datasheet, PDF

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Searched Keyword : 'Package' - Total: 14813 (7/741) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
KEC(Korea Electronics)
KDS4148U Datasheet pdf image
349Kb/1P
USC PACKAGE
KRA301E Datasheet pdf image
25Kb/1P
USM PACKAGE
BAS23W Datasheet pdf image
349Kb/1P
USM PACKAGE
KRA307V Datasheet pdf image
364Kb/1P
VSM PACKAGE
KDV355F Datasheet pdf image
49Kb/1P
TFSC PACKAGE
KRA311 Datasheet pdf image
21Kb/1P
USM PACKAGE
KRA312V Datasheet pdf image
363Kb/1P
VSM PACKAGE
KRA313 Datasheet pdf image
21Kb/1P
USM PACKAGE
KRA313E Datasheet pdf image
26Kb/1P
ESM PACKAGE
KDZ4.7V Datasheet pdf image
21Kb/1P
USC PACKAGE
KRA316V Datasheet pdf image
364Kb/1P
VSM PACKAGE
KTC4080 Datasheet pdf image
21Kb/1P
USM PACKAGE
KTN2369U Datasheet pdf image
21Kb/1P
USM PACKAGE
KRA321V Datasheet pdf image
364Kb/1P
VSM PACKAGE
Company Logo Img
Zentrum Mikroelektronik...
MDS717 Datasheet pdf image
156Kb/1P
Package PQFP80
MDS722 Datasheet pdf image
151Kb/1P
Package PQFP144
MDS756 Datasheet pdf image
154Kb/1P
Package SSOP16
MDS724 Datasheet pdf image
148Kb/1P
Package PLCC84
MDS752 Datasheet pdf image
155Kb/1P
Package SOP16
MDS761 Datasheet pdf image
27Kb/1P
Package SSOP14

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What is Package


In electronic parts, PACKAGE means a case or package used to protect and connect devices.

PACKAGE plays an important role in protecting and connecting devices.

If the device is not properly protected, environmental influences can damage or destroy the device.

PACKAGE comes in various shapes and sizes, and there are various types depending on the type and purpose of the device.

Representative packages include DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), and BGA (Ball grid array).

A DIP is one of the more representative packages and has two pins placed in-line.

SOPs are smaller packages than DIPs and have a rectangular shape.

QFP is a package with pins parallel to the circumference of the package, and BGA is a package in which small holes are drilled in the bottom of the elements and small beads are attached to them to connect the elements.

Depending on the characteristics of each package, it is used for various purposes.

For example, DIPs are generally used for low-density integrated circuits, and BGAs are used for high-density integrated circuits.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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