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| History | Shrink |
| Next hint word | HEAT |
| Search results of keyword 'Shrink' |
| 1 | 128Mb SDRAM Shrink TSOP 2M x 16Bit x 4 Banks Synchronous DRAM LVTTL | |
 Samsung semiconductor |
KM416S8030BN
KM416S8030BN-G/FH
KM416S8030BN-G/FL
| |
| 2 | 14-LEAD THIN SHRINK SMALL OUTLINE | |
 STMicroelectronics |
TSSOP14
| |
| 3 | 16 Lead Molded Thin Shrink Small Outline Package, JEDEC NS Package Number MTC16 | |
 National Semiconductor |
MTC16
| |
| 4 | 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 | |
 Fairchild Semiconductor |
MSA20
| |
| 5 | 20-LEAD THIN SHRINK SMALL OUTLINE | |
STMicroelectronics |
TSSO20
| |
| 6 | 24-LEAD SHRINK SMALL OUTLINE PACKAGE | |
STMicroelectronics |
SSOP24
| |
| 7 | 48 Lead Molded Thin Shrink Small Outline Package, JEDEC | |
National Semiconductor |
MTD48
| |
| 8 | Ceramic Shrink Small Outline Package | |
 Amkor Technology |
CSSOP
| |
| 9 | Composite Shrink Boot Conduit Fitting | |
 Glenair, Inc. |
712S269XM
| |
| 10 | Composite Standard Profile EMI/RFI Banding Backshell with Shrink Boot Porch | |
Glenair, Inc. |
447AS325XM08
| |
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| Related keyword |
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| Shrink Equivalent | Shrink Application Notes | Shrink Data Sheet | Shrink component | Shrink Fiche Technique | Shrink Circuit |
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