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AU PLATING Datasheet, PDF

Search Description : 'AU PLATING ' - Total: 15510 (1/776) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

Molex Electronics Ltd.
15-91-2255 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 25 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630112 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .180" Pocket, Shrouded, 8Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702462004 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 20Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating
0702462501 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded,26 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, Void
15-91-2165 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 16 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0245 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0740950050 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, Shrouded, 20 Circuits0.38μm (15μ") Gold (Au) Selective Plating over Tin (Sn) Plating
0702463401 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-2115 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 11 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0015477670 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 70 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

RMT Ltd.
1MC04-050-03 Blank ceramics (not metallized) Metallized (Au plating) Metallized (Au plating)

Molex Electronics Ltd.
0702463004 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating
0010897440 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 44 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
0015477654 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0010897800 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 80 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
0705430001 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .120" Pocket, Shrouded, 2Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0363 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702472651 2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430010 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .120" Pocket, Shrouded, 11 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0732510033_V01 50 Ohms, SMA Plug, Solder, RG-402 (.141) Cable, Stainless Steel Body with 0.76μm Gold Plating, 0.76μm Gold Plating on Contact, Bag

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