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PLATING Datasheet, PDF

Search Description : 'PLATING' - Total: 15508 (1/776) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

Molex Electronics Ltd.
0705430004 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .120" Pocket, Shrouded, 5Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0249 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15-80-0305 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630129 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .180" Pocket, Shrouded, 25Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705550091 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shrouded,with Press-fit Plastic Peg, 22 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0010897220 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 22 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
15-80-1521 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
0705410074 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .120" Pocket, Shrouded, with Beveled Plastic Peg, 5 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0403 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702461004 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.13μm (5μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0740950085 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, Shrouded, 25 Circuits0.76μm (30μ") Gold (Au) Selective Plating over Tin (Sn) Plating
0010897102 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 10 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
15-80-0545 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 54 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-3033 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 3 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705550077 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shrouded, with Press-fit Plastic Peg, 8 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0015477612 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705550048 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shrouded,with Press-fit Plastic Peg, 14 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702800491 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 86 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.79mm (.110") PC Tail
0702800459 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 82 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
0702463002 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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