| Electronic Manufacturer | Part Number | Datasheet | Electronics Description |
Molex Electronics Ltd.
|
0705630003 |
 |
2.54mm Pitch SL™ Header, Single Row, Vertical, Pocket, Shrouded, 4Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0015477766 |
|
2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 66 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0705630007 |
|
2.54mm Pitch SL™ Header, Single Row, Vertical, Pocket, Shrouded, 8Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0702475051 |
|
2.54mm Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded,50 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 15-80-0703 |
|
2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0452802053 |
|
3.00mm Pitch Micro-Fit 3.0 BMI CPI™ Compliant Pin Header, Blind Mate Interface, Dual Row, Vertical, 20 Circuits, PA Polyamide Nylon 4/6, UL 94V-0, 0.76μm Gold (Au) Selective Contact Plating, Tin (Sn) Tail Plating |
| 15-91-2125 |
|
2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 12 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 15-80-0225 |
|
2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0702473052 |
|
2.54mm Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0705430125 |
|
2.54mm Pitch SL™ Header, Single Row, Vertical, Pocket, Shrouded, 21Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0702463404 |
|
2.54mm Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.127μm Gold (Au) Plating, Tin(Sn) PC Tail Plating |
| 0702460802 |
|
2.54mm Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 15-80-0685 |
|
2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0702470851 |
|
2.54mm Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded, 8 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 15-91-2115 |
|
2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 11 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0702461401 |
|
2.54mm Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 15-91-3043 |
|
2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 4 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0702473451 |
|
2.54mm Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded34 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0702462604 |
|
2.54mm (.100) Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating |
| 0702474451 |
|
2.54mm Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded44 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
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