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AU PLATING Datasheet, PDF

Search Description : 'AU PLATING ' - Total: 15091 (1/755) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

Molex Electronics Ltd.
15-80-1101 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15-91-3103 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 10 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0740591002 2.54mm Pitch SL™ Header, Single Row, Vertical, Pocket, Shrouded, 21Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630122 2.54mm Pitch SL™ Header, Single Row, Vertical, Pocket, Shrouded, 18Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0703 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0010897082 2.54mm Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 8 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm PC Tail
15-80-1501 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
0705630112 2.54mm Pitch SL™ Header, Single Row, Vertical, Pocket, Shrouded, 8Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0547220404 0.50mm Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical 1.50mm Stacking Height, Lower Circuit Size Version, 40 Circuits, Gold Plating with Nickel Barrier Plating Between Contact and Tail
0702461001 2.54mm Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0740950055 2.54mm Pitch SL™ Header, Single Row, Vertical, Shrouded, 25 Circuits0.38μm Gold (Au) Selective Plating over Tin (Sn) Plating
15-80-0603 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702463402 2.54mm Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0685 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702470869 2.54mm Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded8 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, without
15-80-0369 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
0010897220 2.54mm Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 22 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm PC Tail
0705430108 2.54mm Pitch SL™ Header, Single Row, Vertical, Pocket, Shrouded, 4Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702474052 2.54mm Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded40 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0010897363 2.54mm Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 36 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.79mm PC Tail

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