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3.56MM Datasheet, PDF

Search Description : '3.56MM' - Total: 39 (1/2) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

Molex Electronics Ltd.
0357302900 3.56mm Diameter Pin Receptacle Terminal, Brass, 0.35mm Thickness, Wire Range 14-20 AWG (2.00-0.52mm²), Unplated
0440671002 3.00mm Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm
0440671602 3.00mm Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB
0876090070 1.27mm Pitch DIMM 8-Byte Socket, Right Angle, Multi-Key, 168 Circuits, withBeveled Metal Pins and Plastic Pegs, with Beige Latches, 3.56mm Tail Length0.38μm Gold (Au) Plating, Center Function Key, Leadfree
0440672002 3.00mm Pitch Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm Thick PCB, 2 Circuits, 0.38μm Gold (Au) Selective Plating
0440672401 3.00mm Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB
0440671603 3.00mm Pitch Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 16 Circuits, 0.76μm Gold (Au) Selective Plating

Tyco Electronics
5536614-1 Z-PACK 2mm FB, POWER MODULE, RCPT. ASSY. 4 ROW, 3.56mm LEAD LENGTH PRESS FIT LEAD

Molex Electronics Ltd.
0440671601 3.00mm Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm
0440670601 3.00mm Pitch Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 6 Circuits, Tin (Sn) Plating
0440670402 3.00mm Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB
0440672201 3.00mm Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm
0440670801 3.00mm Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm
0440671202 3.00mm Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB
0357307200 3.56mm Diameter Pin Terminal, Brass, 0.50mm Thickness, Wire Range 14-20 AWG (2.00-0.52mm²), 15.50mm Pitch, Unplated
0440670401 3.00mm Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB
0440670403 3.00mm Pitch Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 4 Circuits, 0.76μm Gold (Au) Selective Plating
0440670602 3.00mm Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm
0876090069 1.27mm Pitch DIMM 8-Byte Socket, Right Angle, Multi-Key, 168 Circuits, withBeveled Metal Pins and Plastic Pegs, with Beige Latches, 3.56mm Tail Length,
0440672001 3.00mm Pitch Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits, Tin (Sn) Plating

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