| Electronic Manufacturer | Part Number | Datasheet | Electronics Description |
Hamamatsu Corporation
|
S9979 |
 |
CCD area image sensor TDI operation / large active area CCD |
Japan Aviation Electron...
|
ST7S014V4B |
|
CONTACTING AREA : GOLD OVER NICKEL TERMINAL AREA : GOLD FLASH OVER NICKEL |
Hamamatsu Corporation
|
S9979_11 |
|
CCD area image sensor TDI operation / large active area CCD |
Fairchild Semiconductor
|
CCD595_04 |
|
9216 x 9216 Pixel Image Area 9216 x 9216 Pixel Image Area |
Panasonic Semiconductor
|
MN39242FT |
|
CCD Area Image Sensor Diagonal 4.5 mm (type-1/4) 570k-pixel CCD Area Image Sensor |
NXP Semiconductors
|
PESD1CAN215 |
|
PESD1CAN in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package designed to protect two automotive Controller Area Network (CAN) bus lines from the damage caused by ElectroStatic Discharge (ESD) and other transients. |
List of Unclassifed Man...
|
SSB-COB15031GW |
|
150mm x 31mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565NM green |
Texas Instruments
|
TAFE1040 |
|
3 V, 10-BIT 42 MSPS, AREA CCD ANALOG FRONT-END |
Sensortechnics GmbH
|
AD230-8TO |
|
APD with 0.04 mm² active area |
LUMEX INC.
|
SSB-COB15132GW |
|
151mm x 32mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 88 CHIPS, 565mm GREEN, 4.2V 440mA |
Intersil Corporation
|
PRISM1BRDA |
|
OEM Wireless Local Area Network PC Card |
Infineon Technologies A...
|
AUIRF1018ES |
|
Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. |
Molex Electronics Ltd.
|
0191951021 |
|
MagKrimp™ Round Ring Tongue Terminal for 12 AWG Magnet Wire, 10,380-52,480Circular Mil Area, Stud Size 3/8", Plated |
List of Unclassifed Man...
|
C30916E |
|
Large Area Silicon Avalanche Photodiode for General-Purpose Applications |
Sensortechnics GmbH
|
AD500-12TO |
|
APD with 0.2 mm² active area |
Molex Electronics Ltd.
|
0759001281 |
|
3.50mm (.138") Pitch, MX150™ Dual Row Header, Breakaway, Right Angle, 16Circuits, 1.25μm (50μ") Nickel (Ni) Overall, 2.50μm (100μ") Minimum Select Matte Tin(Sn) Plating on Tail, 0.05μm Minimum Select Gold (Au) Contact Area, 3.05mm (.120") |
Siemens Semiconductor G...
|
BSM150GB170DN2E3166 |
|
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Enlarged diode area) |
Ledil, Inc.
|
CA13493 |
|
Beam for area lighting with shorter illumination distances. Optimized for CREE XT-E and XP-G2. Assembly with installation tape. |
Dialight Corporation
|
HZD2C2NC |
|
SafeSite® LED Area Light with Retrofit Adapter Kit |
Toshiba Semiconductor
|
TC6133AF |
|
AREA IMAGE SENSOR CCD(Charge Coupled Device) |
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