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BALL Datasheet, PDF

Searched Keyword : 'BALL' - Total: 993 (10/50) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Festo Corporation.
8097470 Datasheet pdf image
82Kb/2P
Ball valve
11/23/21
4762852 Datasheet pdf image
96Kb/2P
Ball valve
11/18/21
4795672 Datasheet pdf image
102Kb/2P
Ball valve
11/23/21
153486 Datasheet pdf image
87Kb/2P
Ball valve
4/15/22
6837 Datasheet pdf image
81Kb/2P
Ball valve
4/15/22
4762849 Datasheet pdf image
96Kb/2P
Ball valve
11/23/21
4802246 Datasheet pdf image
101Kb/2P
Ball valve
11/23/21
4783596 Datasheet pdf image
96Kb/2P
Ball valve
11/23/21
4795669 Datasheet pdf image
102Kb/2P
Ball valve
11/23/21
4810859 Datasheet pdf image
94Kb/2P
Ball valve
11/23/21
4795673 Datasheet pdf image
101Kb/2P
Ball valve
11/23/21
8089061 Datasheet pdf image
87Kb/2P
Ball valve
7/1/22
8096945 Datasheet pdf image
86Kb/2P
Ball valve
7/1/22
1686689 Datasheet pdf image
96Kb/2P
Ball valve
7/8/22
Company Logo Img
List of Unclassifed Man...
0035-D Datasheet pdf image
67Kb/1P
BALL KNOB
Company Logo Img
Festo Corporation.
4405684 Datasheet pdf image
87Kb/2P
Ball valve
11/23/21
4810853 Datasheet pdf image
93Kb/2P
Ball valve
11/23/21
4451860 Datasheet pdf image
106Kb/2P
Ball valve
11/23/21
4451863 Datasheet pdf image
106Kb/2P
Ball valve
11/23/21
4762847 Datasheet pdf image
96Kb/2P
Ball valve
11/23/21

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What is BALL


In electronic components, ball is commonly used as a term to describe a component or the shape of a component.

Balls are used in a variety of electronic components and can be used primarily for:

Ball Grid Array (BGA): BGA is one of the electronic component packaging technologies and is used to package chips and other components.

A BGA has a grid pattern made up of small balls, which connect to pads on the circuit board.

BGAs provide high-density connectivity and thermal management, and are one of the most popular packaging technologies in modern electronic devices.

Ball Reducing: Refers to the process of reducing the number of balls in a specific component or part.

This can be used to reduce the size of a component or to save space.

Ball Contact Array (BCA): Ball contact array is a technology that uses balls to make connections between a chip package and a circuit board.

BCAs provide high-density connectivity for power and signaling and are used in high-performance computing and communications systems.

Ball Bond: A process used to connect wires on certain chips or other components.

The ball band is used to hold the wire in a ball and connect the ball to the pad on the circuit board. It is mainly used in high frequency and high voltage applications.

Balls play an important role in the connection and packaging of electronic components, and are used in a variety of technologies and applications.

Therefore, in electronic components, balls are considered as important elements related to connection, packaging, signal transmission, etc.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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