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BALL Datasheet, PDF

Searched Keyword : 'BALL' - Total: 993 (2/50) Pages
ManufacturerPart #DatasheetDescription
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Festo Corporation.
534306 Datasheet pdf image
97Kb/2P
Ball valve
7/7/22
1692201 Datasheet pdf image
86Kb/2P
Ball valve
11/22/21
1692198 Datasheet pdf image
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Ball valve
11/22/21
4451856 Datasheet pdf image
106Kb/2P
Ball valve
11/23/21
4762853 Datasheet pdf image
96Kb/2P
Ball valve
11/23/21
4762854 Datasheet pdf image
96Kb/2P
Ball valve
11/23/21
4783595 Datasheet pdf image
96Kb/2P
Ball valve
11/23/21
4783598 Datasheet pdf image
97Kb/2P
Ball valve
11/23/21
4795671 Datasheet pdf image
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Ball valve
11/23/21
8097467 Datasheet pdf image
81Kb/2P
Ball valve
11/23/21
4745216 Datasheet pdf image
82Kb/2P
Ball valve
6/30/22
4745219 Datasheet pdf image
83Kb/2P
Ball valve
6/30/22
4809121 Datasheet pdf image
97Kb/2P
Ball valve
6/30/22
4809124 Datasheet pdf image
95Kb/2P
Ball valve
6/30/22
4809126 Datasheet pdf image
95Kb/2P
Ball valve
6/30/22
4836917 Datasheet pdf image
94Kb/2P
Ball valve
6/30/22
8089040 Datasheet pdf image
96Kb/2P
Ball valve
6/30/22
8089044 Datasheet pdf image
95Kb/2P
Ball valve
6/30/22
8089058 Datasheet pdf image
88Kb/2P
Ball valve
6/30/22
8096668 Datasheet pdf image
86Kb/2P
Ball valve
6/30/22

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What is BALL


In electronic components, ball is commonly used as a term to describe a component or the shape of a component.

Balls are used in a variety of electronic components and can be used primarily for:

Ball Grid Array (BGA): BGA is one of the electronic component packaging technologies and is used to package chips and other components.

A BGA has a grid pattern made up of small balls, which connect to pads on the circuit board.

BGAs provide high-density connectivity and thermal management, and are one of the most popular packaging technologies in modern electronic devices.

Ball Reducing: Refers to the process of reducing the number of balls in a specific component or part.

This can be used to reduce the size of a component or to save space.

Ball Contact Array (BCA): Ball contact array is a technology that uses balls to make connections between a chip package and a circuit board.

BCAs provide high-density connectivity for power and signaling and are used in high-performance computing and communications systems.

Ball Bond: A process used to connect wires on certain chips or other components.

The ball band is used to hold the wire in a ball and connect the ball to the pad on the circuit board. It is mainly used in high frequency and high voltage applications.

Balls play an important role in the connection and packaging of electronic components, and are used in a variety of technologies and applications.

Therefore, in electronic components, balls are considered as important elements related to connection, packaging, signal transmission, etc.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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