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BALL Datasheet, PDF

Searched Keyword : 'BALL' - Total: 993 (9/50) Pages
ManufacturerPart #DatasheetDescription
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Festo Corporation.
4802247 Datasheet pdf image
102Kb/2P
Ball valve
11/23/21
4783600 Datasheet pdf image
97Kb/2P
Ball valve
11/23/21
4810852 Datasheet pdf image
94Kb/2P
Ball valve
11/23/21
4810861 Datasheet pdf image
94Kb/2P
Ball valve
11/23/21
4810862 Datasheet pdf image
95Kb/2P
Ball valve
11/23/21
4809119 Datasheet pdf image
96Kb/2P
Ball valve
6/30/22
4809120 Datasheet pdf image
96Kb/2P
Ball valve
6/30/22
8089041 Datasheet pdf image
98Kb/2P
Ball valve
6/30/22
8089046 Datasheet pdf image
98Kb/2P
Ball valve
6/30/22
8089047 Datasheet pdf image
99Kb/2P
Ball valve
6/30/22
8089055 Datasheet pdf image
86Kb/2P
Ball valve
6/30/22
8096663 Datasheet pdf image
84Kb/2P
Ball valve
6/30/22
8096949 Datasheet pdf image
86Kb/2P
Ball valve
7/1/22
8096950 Datasheet pdf image
86Kb/2P
Ball valve
7/1/22
1686636 Datasheet pdf image
96Kb/2P
Ball valve
7/8/22
1686656 Datasheet pdf image
96Kb/2P
Ball valve
7/8/22
1686663 Datasheet pdf image
96Kb/2P
Ball valve
7/8/22
534302 Datasheet pdf image
97Kb/2P
Ball valve
7/7/22
534309 Datasheet pdf image
97Kb/2P
Ball valve
7/7/22
1692219 Datasheet pdf image
101Kb/2P
Ball valve
7/8/22

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What is BALL


In electronic components, ball is commonly used as a term to describe a component or the shape of a component.

Balls are used in a variety of electronic components and can be used primarily for:

Ball Grid Array (BGA): BGA is one of the electronic component packaging technologies and is used to package chips and other components.

A BGA has a grid pattern made up of small balls, which connect to pads on the circuit board.

BGAs provide high-density connectivity and thermal management, and are one of the most popular packaging technologies in modern electronic devices.

Ball Reducing: Refers to the process of reducing the number of balls in a specific component or part.

This can be used to reduce the size of a component or to save space.

Ball Contact Array (BCA): Ball contact array is a technology that uses balls to make connections between a chip package and a circuit board.

BCAs provide high-density connectivity for power and signaling and are used in high-performance computing and communications systems.

Ball Bond: A process used to connect wires on certain chips or other components.

The ball band is used to hold the wire in a ball and connect the ball to the pad on the circuit board. It is mainly used in high frequency and high voltage applications.

Balls play an important role in the connection and packaging of electronic components, and are used in a variety of technologies and applications.

Therefore, in electronic components, balls are considered as important elements related to connection, packaging, signal transmission, etc.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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