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BGA Datasheet, PDF

ALL AAEON Technology(2)ACCUTEK MICROCIRCUIT CORPORATION(1)Actel Corporation(7)Advanced Analog Technology, Inc.(3)Advanced Thermal Solutions, Inc.(1645)Advanced Thermal Solutions, Inc.(9)Advantech Co., Ltd.(3)Agilent(Hewlett-Packard)(2)Aries Electronics, Inc.(5)ATMEL Corporation(1)BCM Advanced Research.(4)Dallas Semiconductor(1)
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Searched Keyword : 'BGA' - Total: 7 (1/1) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Actel Corporation 		S587-10-272-10-005437 Datasheet pdf image
199Kb/2P		 272 BGA ADAPTER
S582-11-272-10-005414 Datasheet pdf image
176Kb/1P		 272 BGA ADAPTER SOCKET
S582-11-329-12-005414 Datasheet pdf image
171Kb/1P		 329- 31x31mm, 1.27mm BGA ADAPTER SOCKET
BPW329-1270-23AB11 Datasheet pdf image
923Kb/4P		 329-31x31mm, 1.27mm E-TEC BGA SOKET
S587-10-329-12-005437 Datasheet pdf image
205Kb/2P		 329- 31 x 31mm, 1.27mm BGA ADAPTER
BPW272-1270-20AC11 Datasheet pdf image
1Mb/4P		 272-27 x 27mm, 1.27mm E-TEC BGA SOCKET
8635-313-0-00 Datasheet pdf image
319Kb/1P		 Z-LOK BGA SURFACE MOUNT SOCKET 35MM, 313LD, 1.27 C/C

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What is BGA

BGA stands for Ball Grid Array and refers to a type of electronic component package.

BGAs are commonly used for chips and components that require high density and high performance. The BGA package has the following characteristics:

Construction: A BGA has several small solder balls on the bottom of the chip or component.

These balls are usually exposed on the surface and are connected with solder pads.

BGA packages typically have a small volume and miniaturized design, enabling high-density interconnects.

Advantages: BGA packages have several advantages compared to other electronic components packages.

More pins through the solder balls improve electrical connection and heat transfer.

Additionally, the BGA package is shock and vibration resistant, and supports high speed and signal integrity.

Product Applications: BGA packages are mainly used in various applications, such as high-performance computing systems, communication equipment, graphics cards, network equipment, and mobile devices.

In these applications, BGA packages offer advantages such as high processing speed, low power consumption, and space efficiency.

BGA is a type of electronic component package and is widely used in applications requiring high density and high performance.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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