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CHIP DEVICE Datasheet, PDF

ALL 3M Electronics(4)A-BRIGHT Inc(119)A1 PROs co., Ltd.(1)AAEON Technology(1)Aavid, Thermal Division of Boyd Corporation(1)ABC Taiwan Electronics Corp(29)ABCO ELECTRONICS CO.LTD(4)Abracon Corporation(110)ACCUTEK MICROCIRCUIT CORPORATION(2)Actel Corporation(1)Adam Technologies, Inc.(2)ADTech(3)Advanced Crystal Technology(1)Advanced Linear Devices(3)Advanced Micro Devices(16)Advanced Power Electronics Corp.(19)Advanced Semiconductor(8)Advantech Co., Ltd.(12)AEL Crystals Ltd(2)Aeroflex Circuit Technology(1)Agere Systems(21)Aimtron Technology(1)AIT Components Ltd.(1)Allegro MicroSystems(5)Alliance Semiconductor Corporation(9)Allied Components International(284)Alpha & Omega Semiconductors(44)Alpha Industries(6)alpha microelectronics gmbh(2)ALPS ELECTRIC CO.,LTD.(3)Altech corporation(1)Altera Corporation(298)America Semiconductor, LLC(6)American Accurate Components, Inc.(21)AMI SEMICONDUCTOR(7)Amkor Technology(2)Amphenol Corporation(6)ams AG(19)Anachip Corp(9)Analog Devices(59)Anaren Microwave(36)API Delevan(11)API Technologies Corp(6)Aplus Intergrated Circuits(8)Applied Micro Circuits Corporation(6)Aries Electronics, Inc.(2)Arizona Microtek, Inc(7)Asahi Kasei Microsystems(49)ASIX Electronics Corporation(4)Assmann Electronics Inc.(4)ATMEL Corporation(101)AUK corp(65)Austin Semiconductor(4)AVAGO TECHNOLOGIES LIMITED(21)AverLogic Technologies Inc(3)AVX Corporation(192)Bel Fuse Inc.(15)BeRex Corporation(48)Bi technologies(11)Bourns Electronic Solutions(317)BRIGHT LED ELECTRONICS CORP(128)Broadcom Corporation.(25)Bruckewell Technology LTD(7)C-Media Electronics(14)Caddock Electronics, Inc.(3)Caliber Electronics Inc.(16)California Eastern Labs(2)California Micro Devices Corp(16)CAMBION Electronic Components(4)Catalyst Semiconductor(2)Central Semiconductor Corp(272)Central Technologies(101)CHENG-YI ELECTRONIC CO., LTD.(1)Cherry Semiconductor Corporation(1)Chip Integration Technology Corporation(18)Cirrus Logic(8)CITIZEN ELECTRONICS CO., LTD.(53)Clairex Technologies, Inc(5)Coilcraft lnc.(185)Comchip Technology(14)Communications & Power Industries, Inc.(1)Compact Technology Corp.(4)Conexant Systems, Inc(11)Continental Device India Limited(3)Contrinex AG Industrial Electronics(3)Cooper Bussmann, Inc.(7)Core Technology (Shenzhen) Co., Ltd.(2)Cornell Dubilier Electronics(3)Cree, Inc(48)CTS Corporation(13)Cynergy3 Co(1)Cypress Semiconductor(39)Cystech Electonics Corp.(1)Daesan Electronics Corp.(11)Daewoo Semiconductor(8)Dallas Semiconductor(55)Davicom Semiconductor, Inc.(36)DB Lectro Inc(11)Delta Electronics, Inc.(25)Dialight Corporation(11)Dialog Semiconductor(1)Dielectric Laboratories, Inc.(1)Diodes Incorporated(36)DIYI Electronic Technology Co., Ltd.(11)Dubilier(13)E-CMOS Corporation(1)ECM Electronics Limited.(14)ELAN Microelectronics Corp(1)ELM Electronics(1)ELMOS Semiconductor AG(1)Elpida Memory(12)EM Microelectronic - MARIN SA(28)Emcore Corporation(6)Emerson Network Power(1)EPCOS(14)EPIGAP optoelectronic GmbH(79)Epson Company(61)Espros Photonics corp(3)Estek Electronics Co. Ltd(3)ETAL Group(1)Etron Technology, Inc.(2)Everlight Electronics Co., Ltd(560)Exar Corporation(10)Jingjing Microelectronics Co., Ltd(2)List of Unclassifed Manufacturers(149)List of Unclassifed Manufacturers(323)Nanjing International Group Co(2)SHANGHAI BELLING CO., LTD.(8)Shanghai Lunsure Electronic Tech(3)United Chemi-Con, Inc.(10)
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Search Description : 'CHIP DEVICE ' - Total: 49 (1/3) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

Asahi Kasei Microsystem...
EW-412B EW-412B is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
AK8788 AK8788 is ultra-small Hall effect IC of a single silicon chip composed of Hall element and a signal processing IC
EW-400 EW-400 is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
EW-712B EW-712B is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
AK09911C 3-axis magnetometer device suitable for compass application
EQ-433L EQ-433L is composed of an InAs Quantum Well Hall Element and a signal processing IC chip in a package
EQ-730L EQ-730L is composed of an InAs Quantum Well Hall Element and a signal processing IC chip in a package
EW-632 EW-632 is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
EZ-470 EZ-470 is composed of an InAs Hall Element and a signal processing IC chip in a package
AK520S ISDN SINGLE CHIP NT1/(U&S/T-INTERFACE) TRANSCEIVER
EW-750B EW-750B is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
EW-463 EW-463 is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
AKD4628A-B single chip CODEC that includes two channels of ADC and eight channels of DAC.
EW-710B EW-710B is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
EW-432 EW-432 is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
EW-403 EW-403 is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
EW-450B EW-450B is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
EW-652B EW-652B is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
EM-1711 EM-1711 is ultra-small Hall effect ICs of a single silicon chip composed of Hall element and a signal processing IC
EQ-731L EQ-731L is composed of an InAs Quantum Well Hall Element and a signal processing IC chip in a package

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