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CHIP DEVICE Datasheet, PDF

KEC(Korea Electronics)(1)Kemet Corporation(151)Kersemi Electronic Co., Ltd.(89)Keysight Technologies(25)King blillion Electronics Co.,Ltd.(3)Kingbright Corporation(857)Kingtronics International Company(4)Knowles Electronics(3)KOA Speer Electronics, Inc.(118)KODENSHI KOREA CORP.(190)Kyocera Kinseki Corpotation(4)Laird Tech Smart Technology(1)Lattice Semiconductor(9)Leshan Radio Company(4)Level One(1)Linear Integrated Systems(1)Linear Technology(36)Linkage Goston Electronics Co., LTD(59)Lite-On Technology Corporation(115)Littelfuse(194)Lucky Light Electronic(1)LUMEX INC.(130)Lumileds Lighting Company(5)M/A-COM Technology Solutions, Inc.(35)Macronix International(14)Marktech Corporate(154)Marl International Limited(1)Maxim Integrated Products(29)Mean Well Enterprises Co., Ltd.(4)Megawin Technology Co., Ltd(11)Melexis Microelectronic Systems(1)MERITEK ELECTRONICS CORPORATION(17)Micrel Semiconductor(20)Micro Analog systems(1)Micro Commercial Components(46)Micro Linear Corporation(4)Microchip Technology(26)Microsemi Corporation(18)Micross Components(11)Mimix Broadband(5)Minilogic Device Corporation Limited(1)Mitel Networks Corporation(11)Mitsubishi Electric Semiconductor(22)MMD Components(4)Molex Electronics Ltd.(15)Molex Electronics Ltd.(16)Monolithic Power Systems(12)Mospec Semiconductor(8)Motorola, Inc(43)MPS Industries, Inc.(8)Murata Manufacturing Co., Ltd.(10073)Murata Power Solutions Inc.(2)Nais(Matsushita Electric Works)(1)National Instruments Corporation(2)National Semiconductor (TI)(35)NEC(23)New Japan Radio(24)New Jersey Semi-Conductor Products, Inc.(5)NIC-Components Corp.(128)NICHIA CORPORATION(179)Nichicon corporation(24)NIHON DEMPA KOGYO(21)Nihon Inter Electronics Corporation(4)Nippon Precision Circuits Inc(2)NTE Electronics(8)NXP Semiconductors(47)Ohmite Mfg. Co.(12)Okaya Electric America, Inc.(1)OKI electronic componets(28)OmniVision Technologies, Inc.(4)Omron Electronics LLC(2)ON Semiconductor(135)OPLINK Communications Inc.(4)OPTEK Technologies(4)OptoSupply International(3)ORing Industrial Networking Corp(10)Oscilent Corporation(2)OSRAM GmbH(65)Oxford Semiconductor(3)Shenzhen Luguang Electronic Technology Co., Ltd(9)Tyco Electronics(104)
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Search Description : 'CHIP DEVICE ' - Total: 46 (1/3) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

NXP Semiconductors
SAA7806 One chip automotive CD audio device
UJA1078 High-speed CAN/dual LIN core system basis chip
PBSS4350SS.115 NPN/NPN double low VCEsat Breakthrough In Small Signal (BISS) transistor in a medium power Surface-Mounted Device (SMD) plastic package.
BCX52-10-115 PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages.
LPC1311_1008 32-bit ARM Cortex-M3 microcontroller up to 32 kB flash and 8 kB SRAM USB device
UJA1061 Fault-tolerant CAN/LIN fail-safe system basis chip
PESD1CAN215 PESD1CAN in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package designed to protect two automotive Controller Area Network (CAN) bus lines from the damage caused by ElectroStatic Discharge (ESD) and other transients.
UJA1069 LIN fail-safe system basis chip
TEA5760UK Single chip FM stereo radio
PUMB2115 PNP/PNP double Resistor-Equipped Transistors (RET) in Surface-Mounted Device (SMD) plastic packages.
UJA1061_10 Fault-tolerant CAN/LIN fail-safe system basis chip
PESD24VS1UA115 Unidirectional ElectroStatic Discharge (ESD) protection diode in a SOD323 (SC-76) very small Surface-Mounted Device (SMD) plastic package designed to protect one signal line from the damage caused by ESD and other transients.
LPC1311_12 32-bit ARM Cortex-M3 microcontroller; up to 32 kB flash and 8 kB SRAM; USB device
UJA1076 High-speed CAN core system basis chip
PCKEL14 2.5 V/3.3 V PECL/ECL 1:5 clock distribution chip
PDTA114EU.115 PNP Resistor-Equipped Transistor (RET) family in small Surface-Mounted Device (SMD) plastic packages.
LPC1311_11 32-bit ARM Cortex-M3 microcontroller; up to 32 kB flash and 8 kB SRAM; USB device
LPC2141FBD64-S Single-chip 16-bit/32-bit ocontrollers; up to 512 kB flash with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC
UJA1075 High-speed CAN/LIN core system basis chip
UJA1079 LIN core system basis chip

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