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CHIP DEVICE Datasheet, PDF

KEC(Korea Electronics)(1)Kemet Corporation(165)Kersemi Electronic Co., Ltd.(89)Keysight Technologies(25)King blillion Electronics Co.,Ltd.(3)Kingbright Corporation(857)Kingtronics International Company(4)Knowles Electronics(3)KOA Speer Electronics, Inc.(118)KODENSHI KOREA CORP.(190)Kyocera Kinseki Corpotation(4)Laird Tech Smart Technology(1)Lattice Semiconductor(9)Leshan Radio Company(4)Level One(1)Linear Integrated Systems(1)Linear Technology(36)Linkage Goston Electronics Co., LTD(83)Lite-On Technology Corporation(115)Littelfuse(194)Lucky Light Electronic(1)LUMEX INC.(130)Lumileds Lighting Company(5)Luminus, Inc(3)M/A-COM Technology Solutions, Inc.(35)Macronix International(14)Marktech Corporate(154)Marl International Limited(1)Maxim Integrated Products(30)Mean Well Enterprises Co., Ltd.(5)Megawin Technology Co., Ltd(11)Melexis Microelectronic Systems(1)MERITEK ELECTRONICS CORPORATION(17)Micrel Semiconductor(20)Micro Analog systems(1)Micro Commercial Components(46)Micro Linear Corporation(4)Microchip Technology(29)Microsemi Corporation(18)Micross Components(11)Mimix Broadband(5)Minilogic Device Corporation Limited(1)Mitel Networks Corporation(11)Mitsubishi Electric Semiconductor(22)Mixed Signal Integration(1)MMD Components(4)Molex Electronics Ltd.(15)Molex Electronics Ltd.(16)Molex Electronics Ltd.(2)Monolithic Power Systems(12)Mospec Semiconductor(8)Motorola, Inc(43)MPS Industries, Inc.(8)Murata Manufacturing Co., Ltd(6343)Murata Manufacturing Co., Ltd.(11330)Murata Power Solutions Inc.(2)Nais(Matsushita Electric Works)(1)National Instruments Corporation(2)National Semiconductor (TI)(35)NEC(23)New Japan Radio(24)New Jersey Semi-Conductor Products, Inc.(5)Nexperia B.V. All rights reserved(2)NIC-Components Corp.(128)NICHIA CORPORATION(179)Nichicon corporation(24)NIHON DEMPA KOGYO(21)Nihon Inter Electronics Corporation(4)Nippon Precision Circuits Inc(2)NTE Electronics(8)Nuvoton Technology Corporation(10)NXP Semiconductors(53)Ohmite Mfg. Co.(12)Okaya Electric America, Inc.(1)OKI electronic componets(28)OmniVision Technologies, Inc.(5)Omron Electronics LLC(2)ON Semiconductor(135)OPLINK Communications Inc.(4)OPTEK Technologies(4)OptoSupply International(3)ORing Industrial Networking Corp(10)Oscilent Corporation(2)OSRAM GmbH(65)Oxford Semiconductor(3)Shanghai Leiditech Electronic Technology Co., Ltd(1)Shenzhen Luguang Electronic Technology Co., Ltd(9)Shenzhen Xinmao Microelectronics Co., Ltd.(48)Tyco Electronics(104)
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Search Description : 'CHIP DEVICE ' - Total: 52 (1/3) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

NXP Semiconductors
SAA7806 One chip automotive CD audio device
LPC1311_12 32-bit ARM Cortex-M3 microcontroller; up to 32 kB flash and 8 kB SRAM; USB device
UJA1164 Mini high-speed CAN system basis chip with Standby mode & watchdog
BAT54C.215 Planar Schottky barrier diodes with an integrated guard ring for stress protection, encapsulated in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package.
LPC1311 32-bit ARM Cortex-M3 microcontroller; up to 32 kB flash and 8 kB SRAM; USB device
LPC1311_1008 32-bit ARM Cortex-M3 microcontroller up to 32 kB flash and 8 kB SRAM USB device
LPC2141_08 Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC
MC33794 Electric Field Imaging Device
MC33941 Electric Field Imaging Device
LPC2880 16/32-bit ARM microcontrollers; 8 kB cache, up to 1 MB flash, Hi-Speed USB 2.0 device, and SDRAM memory interface
UJA1061_10 Fault-tolerant CAN/LIN fail-safe system basis chip
FS6500 Safety Power System Basis Chip with CAN FD and LIN
PDTA114EU.115 PNP Resistor-Equipped Transistor (RET) family in small Surface-Mounted Device (SMD) plastic packages.
UJA1163 Mini high-speed CAN system basis chip with Standby mode
BAS70H.115 General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.
MC33907-MC33908D2 Power system basis chip with high speed CAN and LIN transceivers
TEA5760UK Single chip FM stereo radio
BAS316.115 High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages
UJA1065 High-speed CAN/LIN fail-safe system basis chip
PBSS4350SS.115 NPN/NPN double low VCEsat Breakthrough In Small Signal (BISS) transistor in a medium power Surface-Mounted Device (SMD) plastic package.

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