DIE-CAST Datasheet(PDF) - S6302

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What is DIE-CAST

In electronic parts, 'Die-Cast' refers to the casting method used in the manufacturing process of electronic parts. Casting is the process of injecting liquid or molten metal into a mold of a specific shape and forming it into a solid. Die-Casting, also called pressure casting, is performed by compressing metal under high pressure and injecting it into a mold.

The Die-Cast process consists of the following steps:

Mold Fabrication: We create molds (die cavities) to be used in the casting process. A mold serves to form a shape by injecting metal into a specific shape.

Melting Metal: Melts the metal to be used for casting. Various alloys are commonly used, mainly aluminum, zinc and magnesium.

Injection: The molten metal is injected into a mold under pressure. When pouring, maintain the appropriate speed and pressure to form the desired shape.

Hardening and cooling: The cast metal is hardened and cooled in a mold. At this stage, the cast part gains strength and can be separated from the mold.

Die-Casting is used in the production of various parts such as metal elements, housings and frames in the manufacture of electronic components. This method provides highly sophisticated geometries and fast production speeds, enabling a cost-effective manufacturing process. In addition, Die-Casting has the advantage of improving the strength, durability, and thermal conductivity of parts.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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Manufacturer	Part #	Datasheet	Description
Rohm	S6302	512Kb/4P	SiC Schottky Barrier Diode Bare Die
	S6204	500Kb/4P	SiC Schottky Barrier Diode Bare Die
	S6304	437Kb/4P	SiC Schottky Barrier Diode Bare Die
	S6401	976Kb/5P	SiC Schottky Barrier Diode Bare Die
	S6404	986Kb/5P	SiC Schottky Barrier Diode Bare Die
	S6403	984Kb/5P	SiC Schottky Barrier Diode Bare Die
	S6203	436Kb/4P	SiC Schottky Barrier Diode Bare Die
	S6301	437Kb/4P	SiC Schottky Barrier Diode Bare Die
	S6306	438Kb/4P	SiC Schottky Barrier Diode Bare Die
	S6202	436Kb/4P	SiC Schottky Barrier Diode Bare Die
	S6205	437Kb/4P	SiC Schottky Barrier Diode Bare Die
	S6207	436Kb/4P	SiC Schottky Barrier Diode Bare Die
	S6201	513Kb/4P	SiC Schottky Barrier Diode Bare Die
	S2308	731Kb/12P	N-channel SiC power MOSFET bare die
	S2301	870Kb/12P	N-channel SiC power MOSFET bare die
	S2306	951Kb/13P	N-channel SiC power MOSFET bare die
	S4001	667Kb/13P	N-channel SiC power MOSFET bare die
	S4504	1Mb/13P	N-channel SiC power MOSFET bare die 9.Feb.2022 - Rev.001
	S4602	1Mb/13P	N-channel SiC power MOSFET bare die 9.Feb.2022 - Rev.0
	S2305	795Kb/12P	N-channel SiC power MOSFET bare die

DIE-CAST Datasheet, PDF

What is DIE-CAST

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