DIFFUSION Datasheet(PDF) - LT1P53A - Sharp Corporation

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DIFFUSION Datasheet, PDF

: Panasonic Semiconductor(206)Sharp Corporation(36)Siemens Semiconductor Group(2)
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Searched Keyword : 'DIFFUSION' - Total: 36 (1/2) Pages

Manufacturer	Part #	Datasheet	Description
Sharp Corporation	LT1P53A	89Kb/4P	3.3X2.9mm, 1.1mm Thickness,Milky Diffusion Chip LED Devices
	LT1T51A	101Kb/5P	3.3X2.9mm, 1.1mm Thickness, Colored Diffusion Chip LED Devices
	GL8PR2	78Kb/4P	2.5X5.0mm, Arch Type, Colored Diffusion LED Lams for Indicator
	GL8PR42	80Kb/4P	2.0X4.0mm, Rectangle Type, Colored Diffusion LED Lamps for Indicator
	GL2PR6	91Kb/4P	첩2mm, Convex Type, Colored Diffusion LED Lamps for Indicator
	LT1T73A	101Kb/5P	2.7X51.45mm, 0.9mm Thickness, Compact Milky Diffusion Chip LED Devices
	GL8PR22	78Kb/4P	5.0X5.0mm, Square Type, Colored Diffusion LED Lamps for Indicator
	GL8PR28	78Kb/4P	Isosceles Triangle, Colored Diffusion LED Lamps for Direction Indicator
	GL8HD23	95Kb/4P	2.0X4.5mm, Rectangle Type, Colored Diffusion LED Lamps for Indicator
	GL8HD48	100Kb/4P	3.0X3.0mm, Square Type, Colored Diffusion LED Lamps for Indicator
	GL8PR29	86Kb/4P	2.0X3.2mm, Rectangle Type, Colored Diffusion LED Lamps for Indicator
	LT1ET53A	120Kb/5P	3.3X2.9mm, 1.1mm Thickness, Milky Diffusion, Dichromatic Chip LED Devices
	GL4PR8	81Kb/4P	첩4mm, Cylinder Type, Colored Diffusion LED Lamps for Indicator
	GL4HY8	121Kb/6P	4mm, CYLINDER TYPE, COLORED DIFFUSION LED LAMPS FOR INDICATOR
	GL8PR26	79Kb/4P	2.0X5.0mm, Rectangle Type(Flangeless), Colored Diffusion LED Lamps for Indicator
	GL9ED2	223Kb/4P	2.0X5.0mm, Rectangle Type, Milky Diffusion, Dichromatic LED Lamps for Indicator
	GL8ED5	226Kb/4P	1.9X3.9mm, Rectangle Type, Milky Diffusion, Dichromatic LED Lamps for Indicator
	GL1PR112	98Kb/4P	첩2mm, Forming Type, Colored Diffusion, Compact LED Lamp for Backlight/Indicator
	GL3PR63	80Kb/4P	첩3mmT-1, Cylinder TypeFlangeless, Colored Diffusion LED Lamps for Backlight/Indicator
	LT9525D	97Kb/4P	첩20mm, Dome Type, Colored Diffusion, Large LED Lamps for Indoor Use

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What is DIFFUSION

In electronic components, 'diffusion' is one of the semiconductor manufacturing processes, which means the process of injecting ions or atoms into semiconductor materials to form desired materials. Diffusion is used to control the distribution of doping materials within semiconductor devices or to form semiconductor regions with desired characteristics.

Diffusion consists of the following steps:

Purification: Refining semiconductor raw materials and preparing components in a clean state. This process ensures an accurate diffusion process by removing impurities and keeping the semiconductor substrate clean.

Masking: During the diffusion process, a masking material is used to protect the substrate to define the desired semiconductor region. Masking restricts the area so that diffusion only occurs where desired.

Diffusion: Inject the desired material into the substrate using diffusion equipment. Ions or atoms penetrate the surface of the semiconductor substrate and diffuse into the substrate to control the concentration of the substance. Diffusion time and temperature are important parameters that determine the diffusion rate and concentration of a substance.

Reverse Diffusion and Purification: Once diffusion is complete, unwanted material is removed using reverse diffusion or diffusion equipment. This step is performed to purify the semiconductor substrate.

Diffusion is one of the important steps in the semiconductor manufacturing process, and it affects the electrical characteristics and operation of semiconductor devices. In particular, diffusion is used for important tasks such as controlling the doping level of semiconductor devices, forming pn junctions, and creating multilayer structures.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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