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DIP Datasheet, PDF

Searched Keyword : 'DIP' - Total: 28 (1/2) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Motorola, Inc
M4N37 Datasheet pdf image
140Kb/8P
6-Pin DIP Optoisolators Transistor Output
MTIL117 Datasheet pdf image
138Kb/8P
6-Pin DIP Optoisolator Transistor Output
MCT2 Datasheet pdf image
267Kb/6P
6-Pin DIP Optoisolators Transistor Output
4N25 Datasheet pdf image
280Kb/6P
6-Pin DIP Optoisolators Transistor Output
H11A1 Datasheet pdf image
262Kb/6P
6-Pin DIP Optoisolators Transistor Output
M4N25 Datasheet pdf image
139Kb/8P
6-Pin DIP Optoisolators Transistor Output
H11L1 Datasheet pdf image
275Kb/6P
6-Pin DIP Optoisolators Logic Output
M4N26 Datasheet pdf image
139Kb/8P
6-Pin DIP Optoisolators Transistor Output
MTIL113 Datasheet pdf image
100Kb/4P
6-Pin DIP Optoisolators Darlington Output
MOC5007 Datasheet pdf image
292Kb/6P
6-Pin DIP Optoisolators Logic Output
MOC8080 Datasheet pdf image
194Kb/6P
6-Pin DIP Optoisolators Darlington Output
H11AA1 Datasheet pdf image
281Kb/6P
6-Pin DIP Optoisolators AC Input/Transistor Output
MOC3051 Datasheet pdf image
329Kb/8P
6-Pin DIP Random-Phase Optoisolators Triac Drivers
MOC119 Datasheet pdf image
265Kb/6P
6-Pin DIP Optoisolator Darlington Output(No Base Connection)
MOC3061 Datasheet pdf image
290Kb/6P
6-Pin DIP Zero-Cross Optoisolators Triac Driver Output
MOC8050 Datasheet pdf image
274Kb/6P
6-Pin DIP Optoisolators Darlington Ouput(No Base Connection)
MOC8111 Datasheet pdf image
276Kb/6P
6-Pin DIP Optoisolators Transistor Output(No Base Connection)
MOC3010 Datasheet pdf image
310Kb/6P
6-Pin DIP Random-Phase Optoisolators Triac Driver Output
MOC3081 Datasheet pdf image
291Kb/6P
6-Pin DIP Zero-Cross Optoisolators Triac Driver Output
H11G1 Datasheet pdf image
300Kb/6P
6-Pin DIP Optoisolators Darlington Output(On-Chip Resistors)

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What is DIP


In electronic components, 'DIP' is an abbreviation for Dual In-Line Package, meaning Dual In-Line Package. DIP is a type of package that encloses and protects electronic components.

DIP packages are used to protect electronic components and provide mechanical support. This is to ensure that the component can interact with other components or be correctly mounted to the board. The DIP package has pins, which are used to connect electronic components to circuits and to transmit electrical signals.

DIP packages are mainly used for small-sized electronic components such as resistors, capacitors, and integrated circuits (ICs). The DIP package has pins arranged in two rows, which is the origin of the DIP package's name, Dual In-Line Package.

The DIP package provides mechanical support for the component, making it easy to mount and remove the component from the board. However, in recent years, surface-mount device (SMD) packages, which are smaller and higher-density packages of electronic components, have become more widely used. The SMD package is used by directly soldering parts to the board without pins, and has the advantage of saving space and increasing the efficiency of the manufacturing process. So while some electronic components come in DIP packages, modern electronic components tend to use SMD packages mostly.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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