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DIP Datasheet, PDF

Searched Keyword : 'DIP' - Total: 38 (1/2) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
NEC
PS7142-2A Datasheet pdf image
44Kb/7P
8 PIN DIP SOLID STATE RELAY
PS7111-2A Datasheet pdf image
50Kb/6P
8 PIN DIP SOLID STATE RELAY
PS2561D-1 Datasheet pdf image
127Kb/13P
DIP PHOTOCOUPLER OPERATING AMBIENT TEMPERATURE 110째C
PS7112-1A Datasheet pdf image
53Kb/6P
6 PIN DIP SOLID STATE RELAY
PS2561B-1 Datasheet pdf image
179Kb/17P
DIP PHOTOCOUPLER OPERATING AMBIENT TEMPERATURE 110째C
PS7342C-1A Datasheet pdf image
55Kb/6P
6 PIN DIP SOLID STATE RELAY
PS7360 Datasheet pdf image
50Kb/5P
HIGH ISOLATION VOLTAGE 6 PIN DIP SOLID STATE RELAY
PS7122-2B Datasheet pdf image
25Kb/2P
8 PIN DIP TYPE OPTO-COUPLED SOLID DTATE RELAY
PS7341-1B Datasheet pdf image
68Kb/12P
HIGH ISOLATION VOLTAGE 6-PIN DIP OCMOS FET 1-ch OCMOS FET
PS7360-1A Datasheet pdf image
74Kb/12P
6-PIN DIP, HIGH ISOLATION VOLTAGE 1-ch Optical Coupled MOS FET
PS7342-1A Datasheet pdf image
74Kb/12P
6-PIN DIP, HIGH ISOLATION VOLTAGE 1-ch Optical Coupled MOS FET
PS7141-2A Datasheet pdf image
46Kb/6P
8 PIN DIP 400 V BREAKDOWN VOLTAGE 2-CH OPTICAL COUPLED MOSFET
PS9661 Datasheet pdf image
2Mb/8P
NECs HIGH NOISE REDUCTION 25 Mbps CMOS OUTPUT TYPE 8-PIN DIP OPTOCOUPLER
PS7341B-1B Datasheet pdf image
31Kb/2P
6 PIN DIP LOW OUTPUT CAPACITANCE, LOW ON-STATE RESISTANCE, SOLID STATE RELAY
PS9614 Datasheet pdf image
130Kb/7P
NECs HIGH NOISE REDUCTION HIGH SPEED DIGITAL OUTPUT TYPE 8 PIN DIP OPTOCOUPLER
PS7111-2A Datasheet pdf image
71Kb/12P
8-PIN DIP, 100 V BREAK DOWN VOLTAGE 2-ch Optical Coupled MOS FET
PS7160-2A Datasheet pdf image
72Kb/6P
8-PIN DIP, 600 V BREAK DOWN VOLTAGE 2-ch Optical Coupled MOS FET
PS7112-1A Datasheet pdf image
74Kb/12P
6-PIN DIP, 200 mA CONTINUOUS LOAD CURRENT 1-ch Optical Coupled MOS FET
PS9552 Datasheet pdf image
218Kb/22P
2.5 A OUTPUT CURRENT, HIGH CMR IGBT GATE DRIVE PHOTOCOUPLER 8-PIN DIP PHOTOCOUPLER
PS7141C-2A Datasheet pdf image
71Kb/12P
8-PIN DIP, 200 mA TYP. CURRENT LIMIT TYPE 2-ch Optical Coupled MOS FET

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What is DIP


In electronic components, 'DIP' is an abbreviation for Dual In-Line Package, meaning Dual In-Line Package. DIP is a type of package that encloses and protects electronic components.

DIP packages are used to protect electronic components and provide mechanical support. This is to ensure that the component can interact with other components or be correctly mounted to the board. The DIP package has pins, which are used to connect electronic components to circuits and to transmit electrical signals.

DIP packages are mainly used for small-sized electronic components such as resistors, capacitors, and integrated circuits (ICs). The DIP package has pins arranged in two rows, which is the origin of the DIP package's name, Dual In-Line Package.

The DIP package provides mechanical support for the component, making it easy to mount and remove the component from the board. However, in recent years, surface-mount device (SMD) packages, which are smaller and higher-density packages of electronic components, have become more widely used. The SMD package is used by directly soldering parts to the board without pins, and has the advantage of saving space and increasing the efficiency of the manufacturing process. So while some electronic components come in DIP packages, modern electronic components tend to use SMD packages mostly.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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