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DIP Datasheet, PDF

Searched Keyword : 'DIP' - Total: 11 (1/1) Pages
ManufacturerPart #DatasheetDescription
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OKI electronic componet...
OL5200N Datasheet pdf image
44Kb/3P
1.55 關m Laser-Diode DIP Module
OL5200N-5 Datasheet pdf image
44Kb/3P
1.55 關m Laser Diode DIP Module
OL3200N Datasheet pdf image
44Kb/3P
1.3 關m Laser-Diode DIP Module
OE3202G-004 Datasheet pdf image
46Kb/4P
1.3 關m Edge-Emitting LED DIP Module
OE5202G Datasheet pdf image
43Kb/3P
1.55 關m Edge-Emitting LED DIP Module
OL5204N-50 Datasheet pdf image
45Kb/3P
1.55 mm High-Power DIP Module with 9mm Profile
OL5201N-25 Datasheet pdf image
49Kb/4P
1.55 關m High-Power Laser-Diode DIP Module
OL3201N-40 Datasheet pdf image
51Kb/4P
1.3 關m High-Power Laser-Diode DIP Module
OL3200N-5 Datasheet pdf image
44Kb/3P
1.3 關m High-Power Laser-Diode DIP Module
OL3204N-100 Datasheet pdf image
44Kb/3P
1.3 mm High-Power DIP Module with 9mm Profile
OL6204N-50 Datasheet pdf image
46Kb/3P
1.6 關m High-Power DIP Module with 9mm Profile

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What is DIP


In electronic components, 'DIP' is an abbreviation for Dual In-Line Package, meaning Dual In-Line Package. DIP is a type of package that encloses and protects electronic components.

DIP packages are used to protect electronic components and provide mechanical support. This is to ensure that the component can interact with other components or be correctly mounted to the board. The DIP package has pins, which are used to connect electronic components to circuits and to transmit electrical signals.

DIP packages are mainly used for small-sized electronic components such as resistors, capacitors, and integrated circuits (ICs). The DIP package has pins arranged in two rows, which is the origin of the DIP package's name, Dual In-Line Package.

The DIP package provides mechanical support for the component, making it easy to mount and remove the component from the board. However, in recent years, surface-mount device (SMD) packages, which are smaller and higher-density packages of electronic components, have become more widely used. The SMD package is used by directly soldering parts to the board without pins, and has the advantage of saving space and increasing the efficiency of the manufacturing process. So while some electronic components come in DIP packages, modern electronic components tend to use SMD packages mostly.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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