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DIP Datasheet, PDF

Searched Keyword : 'DIP' - Total: 21 (1/2) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Infineon Technologies A...
4N25 Datasheet pdf image
408Kb/6P
Industry Standard Single Channel 6 Pin DIP Optocoupler
March 27, 2000-00
ICE5XRXXXXXZ Datasheet pdf image
2Mb/40P
Fixed-frequency 800 V / 950 V CoolSET™ in DIP-7 package
Rev 1.1 2022-07-19
ICE2QR0665Z Datasheet pdf image
1Mb/22P
Off-Line SMPS Quasi-Resonant PWM Controller with integrated 650V CoolMOS짰 and startup cell in DIP-7
Version 2.1, August 30, 2011
ICE2QR2280Z Datasheet pdf image
1Mb/21P
Off-Line SMPS Quasi-Resonant PWM Controller with integrated 800V CoolMOS짰 and startup cell in DIP-7
Version 2.1, August 30, 2011
ICE2QR1765 Datasheet pdf image
1Mb/22P
Off-Line SMPS Quasi-Resonant PWM Controller with integrated 650V CoolMOS짰 and startup cell in DIP-8
Version 2.2, August 30, 2011
ICE2QR1065Z Datasheet pdf image
1Mb/22P
Off-Line SMPS Quasi-Resonant PWM Controller with integrated 650V CoolMOS짰 and startup cell in DIP-7
Version 2.1, August 30, 2011
ICE2QR1765Z Datasheet pdf image
1Mb/22P
Off-Line SMPS Quasi-Resonant PWM Controller with integrated 650V CoolMOS짰 and startup cell in DIP-7
Version 2.1, August 30, 2011
ICE2QR0665 Datasheet pdf image
918Kb/21P
Off-Line SMPS Quasi-Resonant PWM Controller with integrated 650V Startup Cell/Depletion CoolMOS In DIP-8
Version 2.1, Oct 13, 2009
ICE2QR4765 Datasheet pdf image
878Kb/21P
Off-Line SMPS Quasi-Resonant PWM Controller with integrated 650V Startup Cell/Depletion CoolMOS In DIP-8
Version 2.0, Dec 1, 2009
ICE2QR4765Z Datasheet pdf image
1Mb/22P
Off-Line SMPS Quasi-Resonant PWM Controller with integrated 650V CoolMOS짰 and startup cell in DIP-7
Version 2.1, August 30, 2011
ICE2QR4780Z Datasheet pdf image
1Mb/21P
Off-Line SMPS Quasi-Resonant PWM Controller with integrated 800V CoolMOS짰 and startup cell in DIP-7
Version 2.1, August 30, 2011
ICE2QR4765 Datasheet pdf image
286Kb/22P
Off-Line SMPS Quasi-Resonant PWM Controller with integrated 650V Startup Cell/Depletion CoolMOS In DIP-8
Version 2.3, November 14, 2012
ICE3AR10080CJZ Datasheet pdf image
2Mb/33P
Off-Line SMPS Current Mode Controller with integrated 800V CoolMOS짰 and Startup cell (brownout & CCM) in DIP-7
Version 2.0, 11 Jan 2012
ICE3AR10080JZ Datasheet pdf image
2Mb/34P
Off-Line SMPS Current Mode Controllerwith integrated 800V CoolMOS짰 and Startup cell (brownout & frequency jitter) in DIP-7
Version 2.2a, 11 Jan 2012
ICE3AR2280CJZ Datasheet pdf image
2Mb/33P
Off-Line SMPS Current Mode Controller with integrated 800V CoolMOS짰 and Startup cell (brownout & CCM) in DIP-7
Version 2.0, 11 Jan 2012
ICE3AR4780JZ Datasheet pdf image
2Mb/34P
Off-Line SMPS Current Mode Controller with integrated 800V CoolMOS짰 and Startup cell (brownout & frequency jitter) in DIP-7
Version 2.1a, 11 Jan 2012
ICE3BR1065J Datasheet pdf image
1Mb/31P
Off-Line SMPS Current Mode Controller with integrated 650V CoolMOS짰 and Startup cell (frequency jitter Mode) in DIP-8
Version 2.0, 28 Dec 2011
ICE3B0365J Datasheet pdf image
988Kb/28P
Off-Line SMPS Current Mode Controller with integrated 650V CoolMOS짰 and Startup cell (frequency jitter Mode) in DIP-8 Product Highlights
Version 2.6, 4 Jul 2011
ICE3B2065J Datasheet pdf image
913Kb/28P
Off-Line SMPS Current Mode Controller with integrated 650V CoolMOS짰 and Startup cell (frequency jitter Mode) in DIP-8 Product Highlights
Version 2.7, 9 May 2012
ICE3B0365J-T Datasheet pdf image
797Kb/25P
nullOff-Line SMPS Cur rent Mode Controller with integrated 650V CoolMOS® and Startup cel l (frequency j itter Mode) in DIP-8
Version 2.0, 20 Mar 2013

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What is DIP


In electronic components, 'DIP' is an abbreviation for Dual In-Line Package, meaning Dual In-Line Package. DIP is a type of package that encloses and protects electronic components.

DIP packages are used to protect electronic components and provide mechanical support. This is to ensure that the component can interact with other components or be correctly mounted to the board. The DIP package has pins, which are used to connect electronic components to circuits and to transmit electrical signals.

DIP packages are mainly used for small-sized electronic components such as resistors, capacitors, and integrated circuits (ICs). The DIP package has pins arranged in two rows, which is the origin of the DIP package's name, Dual In-Line Package.

The DIP package provides mechanical support for the component, making it easy to mount and remove the component from the board. However, in recent years, surface-mount device (SMD) packages, which are smaller and higher-density packages of electronic components, have become more widely used. The SMD package is used by directly soldering parts to the board without pins, and has the advantage of saving space and increasing the efficiency of the manufacturing process. So while some electronic components come in DIP packages, modern electronic components tend to use SMD packages mostly.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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