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DIP Datasheet, PDF

Searched Keyword : 'DIP' - Total: 52 (1/3) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
California Eastern Labs
PS2561D-1 Datasheet pdf image
271Kb/17P
DIP PHOTOCOUPLER, OPERATING AMBIENT TEMPERATURE 110째C
PS7112-1A Datasheet pdf image
54Kb/6P
6 PIN DIP SOLID STATE RELAY
PS7111-2A Datasheet pdf image
51Kb/6P
8 PIN DIP SOLID STATE RELAY
PS2561F-1 Datasheet pdf image
1Mb/14P
DIP PHOTOCOUPLER, OPERATING AMBIENT TEMPERATURE 110째C
NR8360JP-BC Datasheet pdf image
85Kb/2P
30 um InGaAs APD IN DIP PACKAGE FOR OTDR APPLICATION
PS7160-2A Datasheet pdf image
341Kb/11P
8-PIN DIP, 600V BREAK DOWN VOLTAGE 2-cH Optical Coupled MOSFET
PS7341-1B Datasheet pdf image
358Kb/11P
HIGH ISOLATION VOLTAGE 6-PIN DIP OCMOS FET (1-ch OCMOS FET)
NX7529 Datasheet pdf image
190Kb/4P
NECs 1550 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
PS7341-1A Datasheet pdf image
349Kb/11P
6-PIN DIP, HIGH ISOLATION VOLTAGE 1-ch Optical Coupled MOS FET
NX7561 Datasheet pdf image
185Kb/4P
NECs 1550 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
NX7661 Datasheet pdf image
185Kb/4P
NECs 1625 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
NX7528 Datasheet pdf image
190Kb/4P
NECs 1550 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
PS9617 Datasheet pdf image
399Kb/12P
HIGH NOISE REDUCTION, HIGH SPEED DIGITAL OUTPUT TYPE 8-PIN DIP PHOTOCOUPLER
PS9531 Datasheet pdf image
1Mb/22P
2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 8-PIN DIP PHOTOCOUPLER
PS7141-1A Datasheet pdf image
356Kb/11P
6-PIN DIP, 400V BREAK DOWN VOLTAGE 1-ch Optical Coupled MOS FET
PS7141E-1A Datasheet pdf image
348Kb/12P
6-PIN DIP, 400V BREAK DOWN VOLTAGE 1-ch Optical Coupled MOS FET
PS9614 Datasheet pdf image
216Kb/7P
NECs HIGH NOISE REDUCTION HIGH SPEED DIGITAL OUTPUT TYPE 8 PIN DIP OPTOCOUPLER
PS9506 Datasheet pdf image
3Mb/21P
0.6 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 8-PIN DIP PHOTOCOUPLER
PS9505 Datasheet pdf image
3Mb/22P
2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 8-PIN DIP PHOTOCOUPLER
PS7341B-1B Datasheet pdf image
34Kb/2P
6 PIN DIP LOW OUTPUT CAPACITANCE, LOW ON-STATE RESISTANCE, SOLID STATE RELAY

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What is DIP


In electronic components, 'DIP' is an abbreviation for Dual In-Line Package, meaning Dual In-Line Package. DIP is a type of package that encloses and protects electronic components.

DIP packages are used to protect electronic components and provide mechanical support. This is to ensure that the component can interact with other components or be correctly mounted to the board. The DIP package has pins, which are used to connect electronic components to circuits and to transmit electrical signals.

DIP packages are mainly used for small-sized electronic components such as resistors, capacitors, and integrated circuits (ICs). The DIP package has pins arranged in two rows, which is the origin of the DIP package's name, Dual In-Line Package.

The DIP package provides mechanical support for the component, making it easy to mount and remove the component from the board. However, in recent years, surface-mount device (SMD) packages, which are smaller and higher-density packages of electronic components, have become more widely used. The SMD package is used by directly soldering parts to the board without pins, and has the advantage of saving space and increasing the efficiency of the manufacturing process. So while some electronic components come in DIP packages, modern electronic components tend to use SMD packages mostly.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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