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DIP Datasheet, PDF

Searched Keyword : 'DIP' - Total: 12 (1/1) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Vectron International, ...
C5419 Datasheet pdf image
41Kb/3P
Standard 4-Pin DIP
B-8 Datasheet pdf image
249Kb/3P
Dual-In-Line Package (DIP) TCXOs
VPA1-B1B-40M000 Datasheet pdf image
133Kb/2P
VPA1 14 Pin Dip Crystal Oscillators
VPB1-B1B-40M000 Datasheet pdf image
119Kb/2P
VPB1 Half Size Dip Crystal Oscillators
VPA1 Datasheet pdf image
132Kb/2P
VPA1 14 Pin Dip Crystal Oscillators
VPB1 Datasheet pdf image
118Kb/2P
VPB1 Half Size Dip Crystal Oscillators
C1379 Datasheet pdf image
32Kb/3P
Standard 4-Pin DIP Package (Half Size)
C1419 Datasheet pdf image
35Kb/3P
Standard 4-Pin DIP Package Enable Function
C5379 Datasheet pdf image
38Kb/3P
Standard 4-Pin DIP Package (Half Size)
VCA3-203 Datasheet pdf image
120Kb/2P
VCA3-203, 205 14 Pin Dip Crystal Oscillators
EMXO-380 Datasheet pdf image
295Kb/6P
4 Pin DIP & SMD Evacuated Miniature Crystal Oscillator
C4400 Datasheet pdf image
239Kb/5P
OCXO 4-Pin Dip Surface Mount Package Optional Fast Warm-up

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What is DIP


In electronic components, 'DIP' is an abbreviation for Dual In-Line Package, meaning Dual In-Line Package. DIP is a type of package that encloses and protects electronic components.

DIP packages are used to protect electronic components and provide mechanical support. This is to ensure that the component can interact with other components or be correctly mounted to the board. The DIP package has pins, which are used to connect electronic components to circuits and to transmit electrical signals.

DIP packages are mainly used for small-sized electronic components such as resistors, capacitors, and integrated circuits (ICs). The DIP package has pins arranged in two rows, which is the origin of the DIP package's name, Dual In-Line Package.

The DIP package provides mechanical support for the component, making it easy to mount and remove the component from the board. However, in recent years, surface-mount device (SMD) packages, which are smaller and higher-density packages of electronic components, have become more widely used. The SMD package is used by directly soldering parts to the board without pins, and has the advantage of saving space and increasing the efficiency of the manufacturing process. So while some electronic components come in DIP packages, modern electronic components tend to use SMD packages mostly.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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