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DIP Datasheet, PDF

Searched Keyword : 'DIP' - Total: 16 (1/1) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Hanbit Electronics Co.,...
HMN1M8DVN Datasheet pdf image
95Kb/9P
Non-Volatile SRAM MODULE 8Mbit (1024k x 8bit) 40Pin - DIP, 3.3V
HMN1M8DV Datasheet pdf image
196Kb/9P
Non-Volatile SRAM MODULE 8Mbit (1024k x 8bit) 36Pin-DIP, 3.3V
HMN2M8D Datasheet pdf image
175Kb/9P
Non-Volatile SRAM MODULE 16Mbit (2,048K x 8-Bit), 36Pin-DIP, 5V
HMN4M8D Datasheet pdf image
172Kb/9P
Non-Volatile SRAM MODULE 32Mbit (4,096K x 8-Bit), 40Pin-DIP, 5V
HMN2568D Datasheet pdf image
185Kb/9P
Non-Volatile SRAM MODULE 2Mbit (256K x 8-Bit), 32Pin-DIP, 5V
HMN5128D Datasheet pdf image
174Kb/9P
Non-Volatile SRAM MODULE 4Mbit (512K x 8-Bit),32Pin-DIP, 5V
HMN5128DV Datasheet pdf image
182Kb/9P
Non-Volatile SRAM MODULE 4Mbit (512K x 8-Bit),32Pin-DIP, 3.3V
HMN1288D Datasheet pdf image
172Kb/9P
Non-Volatile SRAM MODULE 1Mbit (128K x 8-Bit), 32Pin-DIP, 5V
HMN4M8DV Datasheet pdf image
182Kb/9P
Non-Volatile SRAM MODULE 32Mbit (4,096K x 8-Bit), 40Pin-DIP, 3.3V
HMN1M8D Datasheet pdf image
167Kb/9P
Non-Volatile SRAM MODULE 8Mbit (1,024K X 8-Bit), 36Pin-DIP, 5V
HMN88D Datasheet pdf image
177Kb/9P
Non-Volatile SRAM MODULE 64Kbit (8K x 8-Bit),28Pin DIP, 5V
HMN328D Datasheet pdf image
157Kb/9P
Non-Volatile SRAM MODULE 256Kbit (32K x 8-Bit),28Pin DIP, 5V
HMN12816D Datasheet pdf image
147Kb/9P
Non-Volatile SRAM MODULE 2Mbit (128K x 16-Bit), 40pin-Dip, 5V
HMN1M8DN Datasheet pdf image
169Kb/9P
Non-Volatile SRAM MODULE 8Mbit (1,024K X 8-Bit), 40Pin-DIP, 5V
HMN28D Datasheet pdf image
171Kb/9P
Non-Volatile SRAM MODULE 16Kbit (2K x 8-Bit), 24pin DIP, 5V
HMN1288DV Datasheet pdf image
98Kb/9P
Non-Volatile SRAM Module 1Mbit (128K x 8-Bit), 32Pin-DIP, 3.3V

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What is DIP


In electronic components, 'DIP' is an abbreviation for Dual In-Line Package, meaning Dual In-Line Package. DIP is a type of package that encloses and protects electronic components.

DIP packages are used to protect electronic components and provide mechanical support. This is to ensure that the component can interact with other components or be correctly mounted to the board. The DIP package has pins, which are used to connect electronic components to circuits and to transmit electrical signals.

DIP packages are mainly used for small-sized electronic components such as resistors, capacitors, and integrated circuits (ICs). The DIP package has pins arranged in two rows, which is the origin of the DIP package's name, Dual In-Line Package.

The DIP package provides mechanical support for the component, making it easy to mount and remove the component from the board. However, in recent years, surface-mount device (SMD) packages, which are smaller and higher-density packages of electronic components, have become more widely used. The SMD package is used by directly soldering parts to the board without pins, and has the advantage of saving space and increasing the efficiency of the manufacturing process. So while some electronic components come in DIP packages, modern electronic components tend to use SMD packages mostly.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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