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DIP Datasheet, PDF

Searched Keyword : 'DIP' - Total: 72 (1/4) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
MTRONPTI
XO5060 Datasheet pdf image
57Kb/1P
Standard DIP/DIL Package
K1523BA Datasheet pdf image
313Kb/2P
14 DIP, 5.0 Volt, Sinewave, VCXO
K1602SE Datasheet pdf image
274Kb/2P
14 DIP, 5.0 Volt, Sinewave, TCVCXO
K1602SE Datasheet pdf image
250Kb/1P
14 DIP, 5.0 Volt, Sinewave, TCVCXO
XO5162 Datasheet pdf image
216Kb/1P
14 pin DIP, 5.0 Volt, Sinewave, OCXO
K1528D Datasheet pdf image
276Kb/1P
14 pin DIP, 5.0 Volt, CMOS, VCXO
K1601 Datasheet pdf image
390Kb/3P
14 pin DIP, 5.0 Volt, Sinewave, TCXO
MV Datasheet pdf image
275Kb/1P
14 DIP, 5.0 Volt, HCMOS/TTL, VCXO
XO5164 Datasheet pdf image
245Kb/1P
14 pin DIP, 3.3 Volt, HCMOS, OCXO
K1601T Datasheet pdf image
281Kb/2P
14 DIP, 5.0 Volt, CMOS/TTL, TCXO
XO5163 Datasheet pdf image
219Kb/1P
14 pin DIP, 12.0 Volt, Sinewave, OCXO
K1100BA Datasheet pdf image
353Kb/2P
14 pin DIP, 5.0 Volt, Clock Oscillator
K3100G Datasheet pdf image
311Kb/2P
14 pin DIP, 5.0 Volt, Clock Oscillator
MV Datasheet pdf image
396Kb/1P
14 DIP, 5.0 Volt, HCMOS/TTL, VCXO
MTXV Datasheet pdf image
58Kb/1P
14 DIP, 5.0 Volt, HCMOS/TTL, TCVCXO
MVP Datasheet pdf image
227Kb/1P
14 pin DIP, 5.0 Volt, PECL, VCXO
K1601 Datasheet pdf image
324Kb/2P
14 pin DIP, 5.0 Volt, Sinewave, TCXO
K1100BA Datasheet pdf image
369Kb/2P
14 PIN dip 5.0 volt clock oscillator
K1602T Datasheet pdf image
257Kb/1P
14 DIP, 5.0 Volt, CMOS/TTL, TCXO
MTXO Datasheet pdf image
242Kb/1P
14 DIP, 5.0 Volt, HCMOS/TTL, TCXO

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What is DIP


In electronic components, 'DIP' is an abbreviation for Dual In-Line Package, meaning Dual In-Line Package. DIP is a type of package that encloses and protects electronic components.

DIP packages are used to protect electronic components and provide mechanical support. This is to ensure that the component can interact with other components or be correctly mounted to the board. The DIP package has pins, which are used to connect electronic components to circuits and to transmit electrical signals.

DIP packages are mainly used for small-sized electronic components such as resistors, capacitors, and integrated circuits (ICs). The DIP package has pins arranged in two rows, which is the origin of the DIP package's name, Dual In-Line Package.

The DIP package provides mechanical support for the component, making it easy to mount and remove the component from the board. However, in recent years, surface-mount device (SMD) packages, which are smaller and higher-density packages of electronic components, have become more widely used. The SMD package is used by directly soldering parts to the board without pins, and has the advantage of saving space and increasing the efficiency of the manufacturing process. So while some electronic components come in DIP packages, modern electronic components tend to use SMD packages mostly.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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