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DIP Datasheet, PDF

Searched Keyword : 'DIP' - Total: 33 (1/2) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Fairchild Semiconductor
H11L1M Datasheet pdf image
669Kb/9P
6-Pin DIP Optocoupler
8DIP300 Datasheet pdf image
134Kb/1P
8-DIP-300 Package Dimensions
FOD420 Datasheet pdf image
295Kb/12P
6-Pin DIP Triac Drivers
H11L1M Datasheet pdf image
516Kb/9P
6-PIN DIP OPTOISOLATORS LOGIC OUTPUT
H11L1M Datasheet pdf image
516Kb/9P
6-PIN DIP OPTOISOLATORS LOGIC OUTPUT
H11N2M Datasheet pdf image
248Kb/10P
6-Pin DIP High Speed Logic Optocouplers
H11N1-M Datasheet pdf image
522Kb/9P
6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS
H11L3M Datasheet pdf image
255Kb/10P
H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler
H11N1 Datasheet pdf image
523Kb/9P
6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS
H11N1M Datasheet pdf image
248Kb/10P
6-Pin DIP High Speed Logic Optocouplers
FOD410 Datasheet pdf image
292Kb/12P
6-Pin DIP Zero-Cross Triac Drivers
MOC8112M_0810 Datasheet pdf image
254Kb/9P
6-Pin DIP Optocoupler for Power Supply Applications
CNY17F23S Datasheet pdf image
566Kb/12P
6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS
MOC3021 Datasheet pdf image
176Kb/7P
6-Pin DIP Random-phase Optoisolators Triac Driver Output
MOC3061-M Datasheet pdf image
538Kb/10P
6-PIN DIP ZERO-CROSS PHOTOTRIAC DRIVER OPTOCOUPLER (600V PEAK)
MOC3061-M Datasheet pdf image
540Kb/10P
6-PIN DIP ZERO-CROSS PHOTOTRIAC DRIVER OPTOCOUPLER (600V PEAK)
MOC3052M Datasheet pdf image
553Kb/11P
6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVERS (600 VOLT PEAK)
MOC8111 Datasheet pdf image
188Kb/10P
6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION)
MOC3051-M Datasheet pdf image
540Kb/11P
6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVERS (600 VOLT PEAK)
MOC8111M Datasheet pdf image
250Kb/9P
6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)

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What is DIP


In electronic components, 'DIP' is an abbreviation for Dual In-Line Package, meaning Dual In-Line Package. DIP is a type of package that encloses and protects electronic components.

DIP packages are used to protect electronic components and provide mechanical support. This is to ensure that the component can interact with other components or be correctly mounted to the board. The DIP package has pins, which are used to connect electronic components to circuits and to transmit electrical signals.

DIP packages are mainly used for small-sized electronic components such as resistors, capacitors, and integrated circuits (ICs). The DIP package has pins arranged in two rows, which is the origin of the DIP package's name, Dual In-Line Package.

The DIP package provides mechanical support for the component, making it easy to mount and remove the component from the board. However, in recent years, surface-mount device (SMD) packages, which are smaller and higher-density packages of electronic components, have become more widely used. The SMD package is used by directly soldering parts to the board without pins, and has the advantage of saving space and increasing the efficiency of the manufacturing process. So while some electronic components come in DIP packages, modern electronic components tend to use SMD packages mostly.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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