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DIP Datasheet, PDF

Searched Keyword : 'DIP' - Total: 245 (1/13) Pages
ManufacturerPart #DatasheetDescription
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Meder Electronic
DIP Datasheet pdf image
433Kb/5P
Molded DIP
DIP24-1A72-12L Datasheet pdf image
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DIP Reed Relays
DIP24-1A75-12D Datasheet pdf image
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DIP Reed Relays
DIP05-1A72-11D Datasheet pdf image
115Kb/2P
DIP Reed Relay
DIP12-1A72-12LHR Datasheet pdf image
115Kb/2P
DIP Reed Relay
DIP05-1A72-12D Datasheet pdf image
99Kb/2P
DIP Reed Relay
DIP05-1C90-51E Datasheet pdf image
116Kb/2P
DIP Reed Relay
DIP05-1A75-10C Datasheet pdf image
113Kb/2P
DIP Reed Relay
DIP12-1A72-13L Datasheet pdf image
115Kb/2P
DIP Reed Relay
DIP05-1A88-12L Datasheet pdf image
136Kb/1P
DIP Reed Relay
DIP12-1B72-19L Datasheet pdf image
115Kb/2P
DIP Reed Relay
DIP05-1C96-51D Datasheet pdf image
114Kb/2P
DIP Reed Relay
DIP15-1A72-10L Datasheet pdf image
117Kb/2P
DIP Reed Relay
DIP15-1B72-19L Datasheet pdf image
98Kb/2P
DIP Reed Relay
DIP05-2A72-21A Datasheet pdf image
115Kb/2P
DIP Reed Relay
DIP24-1A72-12M Datasheet pdf image
140Kb/2P
DIP Reed Relay
DIP12-1A31-16L Datasheet pdf image
103Kb/2P
DIP Reed Relay
DIP24-1A75-13L Datasheet pdf image
74Kb/1P
DIP Reed Relay
DIP12-1A72-11D Datasheet pdf image
95Kb/2P
DIP Reed Relay
DIP05-2A72-21R Datasheet pdf image
93Kb/1P
DIP Reed Relays

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What is DIP


In electronic components, 'DIP' is an abbreviation for Dual In-Line Package, meaning Dual In-Line Package. DIP is a type of package that encloses and protects electronic components.

DIP packages are used to protect electronic components and provide mechanical support. This is to ensure that the component can interact with other components or be correctly mounted to the board. The DIP package has pins, which are used to connect electronic components to circuits and to transmit electrical signals.

DIP packages are mainly used for small-sized electronic components such as resistors, capacitors, and integrated circuits (ICs). The DIP package has pins arranged in two rows, which is the origin of the DIP package's name, Dual In-Line Package.

The DIP package provides mechanical support for the component, making it easy to mount and remove the component from the board. However, in recent years, surface-mount device (SMD) packages, which are smaller and higher-density packages of electronic components, have become more widely used. The SMD package is used by directly soldering parts to the board without pins, and has the advantage of saving space and increasing the efficiency of the manufacturing process. So while some electronic components come in DIP packages, modern electronic components tend to use SMD packages mostly.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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