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DIP Datasheet, PDF

Searched Keyword : 'DIP' - Total: 36 (1/2) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
TAI-SAW TECHNOLOGY CO.,...
TZ1715A Datasheet pdf image
304Kb/4P
HC49US DIP 24.576MHz Crystal Unit
REV. NO.: 1.0
TZ1979A Datasheet pdf image
116Kb/5P
HC49US DIP 48MHz Crystal Unit
REV. NO.: 1.0
TZ2426A Datasheet pdf image
335Kb/5P
Dip 6.0x2.0 32.768KHz Crystal Unit
REV. NO.: 1.0
TZ2430A Datasheet pdf image
71Kb/5P
HC49U DIP 1.8432MHz Crystal Unit
REV. NO.: 2.0
TZ1915A Datasheet pdf image
295Kb/4P
HC49US DIP 25MHz Crystal Unit
REV. NO.: 1.0
TZ1945A Datasheet pdf image
210Kb/4P
HC49US DIP 20MHz Crystal Unit
REV. NO.: 1.0
TZ1866A Datasheet pdf image
79Kb/5P
HC49US DIP 16MHz Crystal Unit
REV. NO.: 1.0
TZ1953A Datasheet pdf image
69Kb/5P
HC49US DIP 3.579545MHz Crystal Unit
REV. NO.: 1.0
TZ2592A Datasheet pdf image
339Kb/5P
HC49US DIP 16MHz Crystal Unit
REV. NO.: 1.0
TZ2596A Datasheet pdf image
117Kb/5P
HC49US DIP 19.44MHz Crystal Unit
REV. NO.: 1.0
TZ1981A Datasheet pdf image
296Kb/4P
HC49U DIP 16MHz Crystal Unit
REV. NO.: 1.0
TZ1962A Datasheet pdf image
911Kb/5P
HC43U DIP 12.8MHz Crystal Unit
REV. NO.: 2.0
TZ1307A Datasheet pdf image
71Kb/5P
HC49US DIP 17.664MHz Crystal Unit
REV. NO.: 2.0
TZ1746A Datasheet pdf image
298Kb/4P
HC49U DIP 2.4576MHz Crystal Unit
REV. NO.: 3.0
TZ2159A Datasheet pdf image
71Kb/5P
HC49US DIP 7.304688MHz Crystal Unit
REV. NO.: 2.0
TZ2121A Datasheet pdf image
276Kb/4P
Cylinder DIP Type 24MHz Crystal Unit
REV. NO.: 2.0
TZ2442A Datasheet pdf image
214Kb/5P
Cylinder DIP Type 25MHz Crystal Unit
REV. NO.: 1.0
TZ1832A Datasheet pdf image
700Kb/5P
Cylinder DIP Type 12MHz Crystal Unit
REV. NO.: 2.0
TZ0924A Datasheet pdf image
207Kb/2P
8.0x3.0mm DIP Tuning Fork 32.768kHz Crystal Unit
REV. NO.: 1.0
TB0821A Datasheet pdf image
520Kb/5P
SAW Filter 140 MHz(BW=0.2MHz) DIP 35.0mmx12.8mm

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What is DIP


In electronic components, 'DIP' is an abbreviation for Dual In-Line Package, meaning Dual In-Line Package. DIP is a type of package that encloses and protects electronic components.

DIP packages are used to protect electronic components and provide mechanical support. This is to ensure that the component can interact with other components or be correctly mounted to the board. The DIP package has pins, which are used to connect electronic components to circuits and to transmit electrical signals.

DIP packages are mainly used for small-sized electronic components such as resistors, capacitors, and integrated circuits (ICs). The DIP package has pins arranged in two rows, which is the origin of the DIP package's name, Dual In-Line Package.

The DIP package provides mechanical support for the component, making it easy to mount and remove the component from the board. However, in recent years, surface-mount device (SMD) packages, which are smaller and higher-density packages of electronic components, have become more widely used. The SMD package is used by directly soldering parts to the board without pins, and has the advantage of saving space and increasing the efficiency of the manufacturing process. So while some electronic components come in DIP packages, modern electronic components tend to use SMD packages mostly.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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