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DIP Datasheet, PDF

Searched Keyword : 'DIP' - Total: 10 (1/1) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0008500113 Datasheet pdf image
52Kb/1P
KK 254 Crimp Terminal, 22-30 AWG, Hot Tin (Sn) Dip Plating
0008500135 Datasheet pdf image
48Kb/1P
KK 254 Crimp Terminal 4809, 22-30 AWG, Hot Tin Dip, Reel
0008500114 Datasheet pdf image
51Kb/1P
KK 254 Crimp Terminal, 22-30 AWG, Bag, Hot Tin (Sn) Dip Plating
0008500113 Datasheet pdf image
190Kb/4P
KK짰 Crimp Terminal, 22-30 AWG, Hot Tin (Sn) Dip, Nickel (Ni) Under Plating
0008500031 Datasheet pdf image
48Kb/1P
KK 254 Cat Ear Crimp Terminal 4809, 22-30 AWG, Hot Tin Dip, Reel
0008500032 Datasheet pdf image
48Kb/1P
KK 254 Cat Ear Crimp Terminal 4809, 22-30 AWG, Hot Tin Dip, Bag
0008500114 Datasheet pdf image
189Kb/4P
KK짰 Crimp Terminal, 22-30 AWG, Bag, Hot Tin (Sn) Dip, Nickel (Ni) Under Plating
0097000001 Datasheet pdf image
47Kb/1P
KK 254 Cat Ear Crimp Terminal 4809, 22-30 AWG, Hot Tin Dip, Bottom Feed Reel
0008500030 Datasheet pdf image
48Kb/1P
KK 254 Cat Ear Crimp Terminal 4809, 22-30 AWG, Hot Tin Dip, 2.20mm Insulation Crimp
0513870530 Datasheet pdf image
30Kb/2P
Mini USB, B-Receptacle, Right-Angle, Short Body, Surface Mount Solder Tails and Through Hole Shell Tabs, with Cover Tape, Reflow DIP Type, Lead-Free

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What is DIP


In electronic components, 'DIP' is an abbreviation for Dual In-Line Package, meaning Dual In-Line Package. DIP is a type of package that encloses and protects electronic components.

DIP packages are used to protect electronic components and provide mechanical support. This is to ensure that the component can interact with other components or be correctly mounted to the board. The DIP package has pins, which are used to connect electronic components to circuits and to transmit electrical signals.

DIP packages are mainly used for small-sized electronic components such as resistors, capacitors, and integrated circuits (ICs). The DIP package has pins arranged in two rows, which is the origin of the DIP package's name, Dual In-Line Package.

The DIP package provides mechanical support for the component, making it easy to mount and remove the component from the board. However, in recent years, surface-mount device (SMD) packages, which are smaller and higher-density packages of electronic components, have become more widely used. The SMD package is used by directly soldering parts to the board without pins, and has the advantage of saving space and increasing the efficiency of the manufacturing process. So while some electronic components come in DIP packages, modern electronic components tend to use SMD packages mostly.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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