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DIP Datasheet, PDF

Searched Keyword : 'DIP' - Total: 15 (1/1) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
GREATECS
DX1 Datasheet pdf image
315Kb/1P
SPST Standard DIP Switches
DX5 Datasheet pdf image
306Kb/5P
End Stackable DIP Switches
DX3 Datasheet pdf image
370Kb/1P
Tri-State Slide Type DIP Switches
DX48 Datasheet pdf image
182Kb/5P
SMT Half Pitch Type DIP Switches
DX516 Datasheet pdf image
259Kb/1P
End Stackable Piano Type DIP Switch
RD3 Datasheet pdf image
264Kb/1P
7.2 x 7.2 mm Rotary DIP Switches
DX19 Datasheet pdf image
209Kb/1P
Single In Line DIP Switches (SIP Switches)
DX62 Datasheet pdf image
1Mb/8P
DIP Switch Half Pitch SMT for Highest Reliability
DX48H Datasheet pdf image
182Kb/5P
SMT Half Pitch Type Halogen-Free DIP Switches
RD18 Datasheet pdf image
167Kb/1P
7x7 mm Rotary DIP Switch with central C-pin
RD83T Datasheet pdf image
394Kb/2P
10 x 10 mm Sealed Rotary DIP Switches (THR)
RD82T Datasheet pdf image
376Kb/2P
10 x 10 mm Sealed Rotary DIP Switches (THR)
RD81T Datasheet pdf image
222Kb/1P
7.4 x 7.4 mm Sealed Mini Rotary DIP Switches (THR)
RD2 Datasheet pdf image
272Kb/1P
10 x 10 mm Rotary DIP Switches with 1:4 Pinout
RD1 Datasheet pdf image
314Kb/1P
10 x 10 mm Rotary DIP Switches with 3:3 Pinout

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What is DIP


In electronic components, 'DIP' is an abbreviation for Dual In-Line Package, meaning Dual In-Line Package. DIP is a type of package that encloses and protects electronic components.

DIP packages are used to protect electronic components and provide mechanical support. This is to ensure that the component can interact with other components or be correctly mounted to the board. The DIP package has pins, which are used to connect electronic components to circuits and to transmit electrical signals.

DIP packages are mainly used for small-sized electronic components such as resistors, capacitors, and integrated circuits (ICs). The DIP package has pins arranged in two rows, which is the origin of the DIP package's name, Dual In-Line Package.

The DIP package provides mechanical support for the component, making it easy to mount and remove the component from the board. However, in recent years, surface-mount device (SMD) packages, which are smaller and higher-density packages of electronic components, have become more widely used. The SMD package is used by directly soldering parts to the board without pins, and has the advantage of saving space and increasing the efficiency of the manufacturing process. So while some electronic components come in DIP packages, modern electronic components tend to use SMD packages mostly.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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