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DIP Datasheet, PDF

Searched Keyword : 'DIP' - Total: 161 (4/9) Pages
ManufacturerPart #DatasheetDescription
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Connor-Winfield Corpora...
MPH51R Datasheet pdf image
59Kb/1P
14 PIN DIP MPH-SERIES
EE24-511 Datasheet pdf image
89Kb/2P
14 PIN DIP 3.3V PECL
MPA61 Datasheet pdf image
55Kb/1P
14 PIN DIP ADVANCED CMOS
AV53R1AG Datasheet pdf image
102Kb/1P
14 PIN DIP ACMOS VCO
EDV54-080-11 Datasheet pdf image
55Kb/1P
16 PIN DIP ECL VCXO
HC61R8 Datasheet pdf image
57Kb/1P
TIGHT TOLERANCE 14 PIN DIP HCMOS
GA23-550 Datasheet pdf image
111Kb/2P
14 PIN DIP PLL PECL VCXO
OFA5AB1BA Datasheet pdf image
153Kb/2P
14 PIN DIP 5.0V SINEWAVE OCXO
HTFL546 Datasheet pdf image
208Kb/2P
3.3V 14 PIN DIP HCMOS TCXO
SW515 Datasheet pdf image
54Kb/1P
14 PIN DIP HIGH SPEED SINEWAVE
SW515G Datasheet pdf image
74Kb/1P
14 PIN DIP HIGH SPEED SINEWAVE
SX62-1503 Datasheet pdf image
100Kb/1P
HIGH FREQUENCY 14 PIN DIP SINEWAVE
JH54R Datasheet pdf image
62Kb/1P
SURFACE MOUNT 8 PIN DIP HCMOS
S61R Datasheet pdf image
59Kb/1P
8 PIN DIP HCMOS ENABLE/DISABLE
SWL511 Datasheet pdf image
57Kb/1P
14 PIN DIP LOW FREQUENCY SINEWAVE
ATV2G Datasheet pdf image
99Kb/2P
5.0V 14 Pin DIP HCMOS TCXO
HTFL680 Datasheet pdf image
204Kb/2P
3.3V 14 PIN DIP HCMOS TCXO
H61R Datasheet pdf image
58Kb/1P
8 PIN DIP HCMOS ENABLE/DISABLE
HC54R8 Datasheet pdf image
58Kb/1P
14 PIN DIP HCMOS/TTL COMPATIBLE
SX63-1503-G Datasheet pdf image
98Kb/1P
HIGH FREQUENCY 14 PIN DIP SINEWAVE

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What is DIP


In electronic components, 'DIP' is an abbreviation for Dual In-Line Package, meaning Dual In-Line Package. DIP is a type of package that encloses and protects electronic components.

DIP packages are used to protect electronic components and provide mechanical support. This is to ensure that the component can interact with other components or be correctly mounted to the board. The DIP package has pins, which are used to connect electronic components to circuits and to transmit electrical signals.

DIP packages are mainly used for small-sized electronic components such as resistors, capacitors, and integrated circuits (ICs). The DIP package has pins arranged in two rows, which is the origin of the DIP package's name, Dual In-Line Package.

The DIP package provides mechanical support for the component, making it easy to mount and remove the component from the board. However, in recent years, surface-mount device (SMD) packages, which are smaller and higher-density packages of electronic components, have become more widely used. The SMD package is used by directly soldering parts to the board without pins, and has the advantage of saving space and increasing the efficiency of the manufacturing process. So while some electronic components come in DIP packages, modern electronic components tend to use SMD packages mostly.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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