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DIP Datasheet, PDF

Searched Keyword : 'DIP' - Total: 161 (5/9) Pages
ManufacturerPart #DatasheetDescription
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Connor-Winfield Corpora...
SX5405-5 Datasheet pdf image
47Kb/1P
HIGH FREQUENCY 14 PIN DIP SINEWAVE
H51R Datasheet pdf image
64Kb/1P
8 PIN DIP HCMOS ENABLE/DISABLE
A73 Datasheet pdf image
118Kb/1P
8 Pin DIP ACMOS Clock Oscillator
JS63R Datasheet pdf image
61Kb/1P
SURFACE MOUNT 8 PIN DIP HCMOS
SX52-1503 Datasheet pdf image
40Kb/1P
HIGH FREQUENCY 14 PIN DIP SINEWAVE
A73AA Datasheet pdf image
120Kb/1P
8 Pin DIP ACMOS Clock Oscillator
OVA5GA3AB Datasheet pdf image
188Kb/2P
14 PIN DIP 5.0V HCMOS OCVCXO
ATV1 Datasheet pdf image
84Kb/2P
14 PIN DIP CMOS/TTL TCXO
ATV2G5 Datasheet pdf image
104Kb/2P
5.0V 14 Pin DIP HCMOS TCXO
EDV54-080-31-155.52M Datasheet pdf image
113Kb/2P
ECL VCXO 16 PIN DIP OSCILLATORS
H73R Datasheet pdf image
36Kb/1P
8 PIN DIP HCMOS ENABLE/DISABLE
SW645 Datasheet pdf image
50Kb/1P
14 PIN DIP HIGH SPEED SINEWAVE
JH56R Datasheet pdf image
59Kb/1P
SURFACE MOUNT 8 PIN DIP HCMOS
HC13R6 Datasheet pdf image
57Kb/1P
14 PIN DIP HIGH SPEED CMOS
HC145 Datasheet pdf image
53Kb/1P
TIGHT TOLERANCE 14 PIN DIP HCMOS
JS51R Datasheet pdf image
62Kb/1P
SURFACE MOUNT 8 PIN DIP HCMOS
AC73 Datasheet pdf image
190Kb/1P
14 PIN DIP ACMOS CLOCK OSCILLATOR
OVA5AB1BA Datasheet pdf image
151Kb/2P
14 PIN DIP 5.0V SINEWAVE OCVCXO
OVB3AC3AB Datasheet pdf image
189Kb/2P
14 PIN DIP 3.3V HCMOS OCVCXO
OVB5AC3AB Datasheet pdf image
190Kb/2P
14 PIN DIP 5.0V HCMOS OCVCXO

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What is DIP


In electronic components, 'DIP' is an abbreviation for Dual In-Line Package, meaning Dual In-Line Package. DIP is a type of package that encloses and protects electronic components.

DIP packages are used to protect electronic components and provide mechanical support. This is to ensure that the component can interact with other components or be correctly mounted to the board. The DIP package has pins, which are used to connect electronic components to circuits and to transmit electrical signals.

DIP packages are mainly used for small-sized electronic components such as resistors, capacitors, and integrated circuits (ICs). The DIP package has pins arranged in two rows, which is the origin of the DIP package's name, Dual In-Line Package.

The DIP package provides mechanical support for the component, making it easy to mount and remove the component from the board. However, in recent years, surface-mount device (SMD) packages, which are smaller and higher-density packages of electronic components, have become more widely used. The SMD package is used by directly soldering parts to the board without pins, and has the advantage of saving space and increasing the efficiency of the manufacturing process. So while some electronic components come in DIP packages, modern electronic components tend to use SMD packages mostly.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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