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ENCAPSULATION Datasheet, PDF

Search Description : 'ENCAPSULATION' - Total: 65 (1/4) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

Sangdest Microelectroni...
209CNQ High purity, high temperature epoxy encapsulation for enhanced mechanical strength and

PHOENIX CONTACT
2947909 Covering hood, for the contact and dust-protected encapsulation of the components, in green design.

KODENSHI KOREA CORP.
SP217 TO-5 type header with clear epoxy encapsulation

AVAGO TECHNOLOGIES LIMI...
ASMT-UYBG High reliability package with enhanced silicone resin encapsulation
ASMT-UWBG High reliability package with enhanced silicone resin encapsulation

PHOENIX CONTACT
2943165 Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design.
2947145 Covering hood, for the contact and dust-protected encapsulation of the components, in green design.

AVAGO TECHNOLOGIES LIMI...
ASMT-JB11-NMP01 Silicone Encapsulation for LED Advantages and Handling Precautions

PHOENIX CONTACT
2945406 Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design.
2947941 Covering hood, for the contact and dust-protected encapsulation of the components, in green design.
2947967 Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design.

Sangdest Microelectroni...
63CPQ080 High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance

MPS Industries, Inc.
R7X1008M ENCAPSULATION MOLDED CHIP INDUCTOR

PHOENIX CONTACT
2943194 Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design. Height: 7.5 mm

Sangdest Microelectroni...
301CNQ High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance

List of Unclassifed Man...
SM6227JT62R0 High temperature molded encapsulation
SM2615FTR845 High temperature molded encapsulation

PHOENIX CONTACT
2946159 Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design.
2947763 Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design. Height: 7.5 mm

Sangdest Microelectroni...
MBR2535 High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance

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