Manufacturer | Part # | Datasheet | Description |
Nais(Matsushita Electri...
|
AQW614 |
55Kb/3P |
GU (General Use) Type [2-Channel (Form A Form B) Type] |
TE Connectivity Ltd
|
SNR |
258Kb/3P |
1 pole 6A, 1 form C (CO), 1 form A (NO) |
Littelfuse
|
R2-400112-RN |
224Kb/2P |
18 V AND 36 V MAX ISO MINI 6.3 MM FORM A, FORM 2A, AND FORM C RELAYS 2021 111722-A |
TE Connectivity Ltd
|
ORWH |
463Kb/3P |
Compact relay with 1 Form A and 1 Form C contact arrangement |
List of Unclassifed Man...
|
T92S7D12-12 |
1Mb/4P |
40A, 2 form A (NO) and 2 form C (CO) switching capability |
Toshiba Semiconductor
|
TLP3303 |
174Kb/7P |
Normally off (1-Form-A) |
TLP220D |
169Kb/8P |
Normally open (1-Form-A) |
Qualtek Electronics Cor...
|
08146 |
221Kb/1P |
WIRE FORM FAN GUARD (120mm) |
08134 |
211Kb/1P |
WIRE FORM FAN GUARD (92mm) |
08156 |
214Kb/1P |
WIRE FORM FAN GUARD (80mm) |
PIC GmbH
|
MS-324-4 |
57Kb/2P |
Form C Reed Sensor - Flatpack |
Ningbo Tianbo Ganglian ...
|
TRA5 |
1Mb/3P |
2 form A contact arrangements |
Molex Electronics Ltd.
|
1210400096 |
171Kb/3P |
DIN Form A over mould |
IXYS Corporation
|
LCC110 |
148Kb/9P |
1-Form-C OptoMOS Relay |
LCC120 |
133Kb/8P |
1-Form-C OptoMOS Relay |
International Rectifier
|
HF20A060ACE |
33Kb/1P |
Hexfred Die in Wafer Form |
PIC GmbH
|
MS-390-4 |
273Kb/2P |
Snap-fit-Form C-Reedsensor |
TE Connectivity Ltd
|
114-13219 |
1Mb/10P |
Stacked Small Form-Factor Pluggable |
AVAGO TECHNOLOGIES LIMI...
|
ADNS-6160-001 |
332Kb/3P |
Small Form Factor Trim Lens |
Qualtek Electronics Cor...
|
08126 |
218Kb/1P |
WIRE FORM FAN GUARD (150mm) |