Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd.
|
0736560000 |
355Kb/6P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關") |
0714391564 |
314Kb/4P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits |
0675810010 |
129Kb/2P |
1.27mm (.050") Pitch Serial ATA Crimp Terminal for Power Cable Receptacle, Gold(Au) Flash Plating, with Reel Direction - Type 2, Lead free |
0736590002 |
112Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 12 Circuits, Gold (Au) 0.76關m (30關 |
0714393164 |
304Kb/4P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits |
0743232051 |
221Kb/4P |
MicroCross??DVI Digital Single Link, High Volume Plug Connector Sub- assemblyESD Type, Gold (Au) Flash, Vertical, with key, 18 Circuits, Lead Free |
0736590001 |
112Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 12 Circuits, Gold (Au) 0.76關m (30關") |
0740950046 |
221Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 16 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating |
0743209014 |
259Kb/4P |
MicroCross??DVI-I Digital/Analog Visual Interface, PCB Receptacle, Panel MountThrough Hole, Right Angle, with Beveled Metal Pins, Gold Flash, Lead Free, Screw |
0743205004 |
231Kb/4P |
MicroCross??DVI-D Digital Visual Interface, PCB Receptacle, Panel Mount, ThroughHole, Vertical, Gold Flash, Lead Free, 2.34mm (.092") P.C. Tail Length, 24 Circuits |
0736590003 |
112Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 12 Circuits, Gold (Au) 0.76關m (30關") |
0676430980 |
200Kb/4P |
Universal Serial Bus (USB) Shielded I/O Receptacle, Right Angle, Type A, HighTemperature Black Nylon, Gold (Au) Flash Plating, PCB Thickness 1.20mm (.047"), |
0702800460 |
294Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 84 Circuits, 0.76關m (30關) Gold (Au) Selective Plating |
0676433910 |
180Kb/4P |
Universal Serial Bus (USB) Shielded I/O Receptacle, Right Angle, Type A, HighTemperature White Nylon, Gold (Au) Flash, PCB Thickness 1.60mm (.063"), without |
0740950055 |
221Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 25 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating |
0744410001 |
817Kb/15P |
0.80mm (.031") Pitch SFP, SFP Plus (SFP+) Host Connector, Z-Axis Pluggable, RightAngle, SMT, 20 Circuits, 0.38關m (15關") Gold (Au) |
0740950085 |
221Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 25 Circuits0.76關m (30關") Gold (Au) Selective Plating over Tin (Sn) Plating |
0736560180 |
399Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 2 Circuits, Gold (Au) 0.76關m (30關") |
0736562001 |
409Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關") |
0740950050 |
221Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 20 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating |