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HEAT Datasheet, PDF

Searched Keyword : 'HEAT' - Total: 18 (1/1) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Ohmite Mfg. Co.
C40 Datasheet pdf image
386Kb/2P
Heat Sink System
B60 Datasheet pdf image
497Kb/2P
Heat Sink System
TAP800J5R0E Datasheet pdf image
105Kb/1P
800 Watt Heat Sinkable Planar
TAP800 Datasheet pdf image
379Kb/2P
800 Watt Heat Sinkable Planar
TAP600J5R0E Datasheet pdf image
100Kb/1P
600 Watt Heat Sinkable Planar
TA1K0PH2R50KE Datasheet pdf image
102Kb/1P
1000 Watt Heat Sinkable Planar
TAP600K2R0 Datasheet pdf image
332Kb/2P
600 Watt Heat Sinkable Planar
TAP600 Datasheet pdf image
370Kb/2P
600 Watt Heat Sinkable Planar
AP830 Datasheet pdf image
279Kb/2P
Single screw mounting to heat sink
TL-SERIES Datasheet pdf image
341Kb/2P
Modular Heat Sinkable Thick Film Power
AP851 Datasheet pdf image
430Kb/2P
Single screw mounting to heat sink
ACL-AP830 Datasheet pdf image
347Kb/2P
Single screw mounting to heat sink
TL54FR500E Datasheet pdf image
126Kb/2P
Modular Heat Sinkable Thick Film Power
33J1R0 Datasheet pdf image
126Kb/2P
Axial Terminal / Surface Mount / Heat Sinkable Packaging
TAP1000 Datasheet pdf image
356Kb/2P
1000 and 2000 Watt Heat Sinkable Planar
CSM Datasheet pdf image
411Kb/2P
Board Mount Heat Sink For TO-220 Devices
SINK-S Datasheet pdf image
353Kb/2P
The heat sink has two types of surface finish
RA-2TX-25E Datasheet pdf image
5Mb/2P
A HEAT SINK IS A MASS OF THERMALLY CONDUCTIVE MATERIAL

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What is HEAT


Heat refers to the heat generated by electronic components. Electronic components operate using electricity, and a certain amount of heat is generated during this operation.

This heat affects the performance of electronic components and can cause them to overheat and damage them.

Therefore, thermal management is very important in electronic components.

Various electronic components and solutions for thermal management have been developed, some of which include:

Heat Sink: A device for absorbing and conducting heat, and is mostly made of metal such as aluminum.

Used for parts that generate a lot of heat, such as CPUs and GPUs.

Fan: It is used with a heat sink that absorbs heat and is used to quickly dissipate heat.

Thermal Interface Material: It is used between the heat sink and the parts, and it quickly dissipates heat by improving heat conduction.

Heat Pipe: This is a technology for effectively transferring heat, and is mainly used in portable devices such as laptops.

Liquid Cooling: This is a cooling technology using liquid, which is used in high-performance computers and game consoles.

These thermal management solutions are critical to maintaining the reliability and performance of electronic components.

Thermal management considerations are therefore essential in the design and manufacture of electronic components.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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