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HOLE Datasheet, PDF

Searched Keyword : 'HOLE' - Total: 242 (2/13) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0015800485 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits
0015800267 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits
0015800363 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits
0015800103 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical Shrouded, High Temperature, 10 Circuits
0015477622 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 22 Circuits
0015800183 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits
0015477656 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 56 Circuits
0015800243 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits
0015800541 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 54 Circuits, Tin (Sn) Plating
0015477540 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, Tin (Sn) Plating
0015477564 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 64 Circuits, Tin (Sn) Plating
0015800081 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
0015800187 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
0015800501 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, Tin (Sn) Plating
0015800361 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating
0015477520 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 20 Circuits, Tin (Sn) Plating
0015477544 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 44 Circuits, Tin (Sn) Plating
0015477570 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 70 Circuits, Tin (Sn) Plating
0015800107 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
0015477518 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, Tin (Sn) Plating

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What is HOLE


Hole is one of the concepts used in semiconductor theory.

Semiconductor is a field that studies the operation of electrons, and the flow of electrons can be explained by the concept of holes, a concept related to the movement of electrons and the lack of electrons at the same time.

Hole refers to electron deprivation, which is caused by the movement of an electron from an atom to which it is bonded.

This indicates a lack of electrons in the bonded atoms.

These holes have a positive charge, as opposed to electrons, and affect electrical behavior.

Hole plays an important role in semiconductor device design.

In particular, in a P-type semiconductor device, the movement of holes and the movement of electrons occur together.

These holes serve to facilitate the movement of current in P-type semiconductor devices.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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