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HOLE Datasheet, PDF

Searched Keyword : 'HOLE' - Total: 404 (3/21) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0877751101 Datasheet pdf image
469Kb/8P
1.00mm (.039) Pitch DDR2 DIMM Socket, Through Hole, 0.76關m (30關) Gold (Au), 4.00mm (0.157) Soldertail, 276 Circuits, Lead free
0878746001 Datasheet pdf image
243Kb/5P
5.08mm (.200), 2.54mm (.100) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus??Pa-S Header, Through Hole, Right Angle, Beveled Metal Pins
0877600818 Datasheet pdf image
166Kb/4P
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 8 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free
0878742004 Datasheet pdf image
210Kb/4P
7.62mm (.300), 5.08mm (.200), 6.35mm (.250) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus??P-S Header, Through Hole, Right Angle, Screw Mount
0877603618 Datasheet pdf image
171Kb/4P
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 36 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free
0879427001 Datasheet pdf image
160Kb/4P
2.50mm (.098)/ 3.50mm (.138) Pitch, Wire-to-Board Connector, PCB Header with Single Fuse Socket, Right Angle, Through Hole Solder Pins, 22 Circuits
0877601218 Datasheet pdf image
172Kb/4P
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free
0878910408 Datasheet pdf image
299Kb/5P
2.54mm (.100) Pitch KK짰 Header, Through Hole, Vertical, 4 Circuit, 2.50關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0878334425 Datasheet pdf image
135Kb/3P
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, Shrouded, Lead-free, 44 Circuits, 0.76關m (30關) Gold (Au) Plating
0878910106 Datasheet pdf image
770Kb/10P
2.54mm (.100) Pitch KK짰 Header, Through Hole, Vertical, 1 Circuit, 2.50 關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0877602218 Datasheet pdf image
172Kb/4P
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 22 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free
0878742003 Datasheet pdf image
210Kb/4P
7.62mm (.300), 6.35mm (.250), 5.08mm (.200) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus??P-S Header, Through Hole, Right Angle, Screw Mount
0878910206 Datasheet pdf image
770Kb/10P
2.54mm (.100) Pitch KK짰 Header, Through Hole, Breakaway, Vertical, 2 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray Packaging, Lead-free
0877601618 Datasheet pdf image
172Kb/3P
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 16 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free
0879110411 Datasheet pdf image
372Kb/6P
2.54mm (.100") Pitch C-Grid짰 Header, Right Angle, Through Hole, 4 Circuits, 0.38關m Gold (Au) Selective Plating, Tube Packaging, Lead-free
0878910601 Datasheet pdf image
770Kb/10P
2.54mm (.100) Pitch KK짰 Header, Through Hole, Breakaway, Vertical, 6 Circuits, 0.025關m (1關) Gold (Au) Plating, Tray Packaging, Lead-free
0877602618 Datasheet pdf image
172Kb/4P
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 26 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free
0877871012 Datasheet pdf image
331Kb/6P
1.00mm (.039) Pitch iCool??Low Profile VRM Socket, VRM 11, Vertical, Through Hole, with Latches, with Beveled Metal Pins, Signal 24, Power 70
0877602418 Datasheet pdf image
172Kb/4P
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 24 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free
0877601818 Datasheet pdf image
172Kb/4P
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 18 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free

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What is HOLE


Hole is one of the concepts used in semiconductor theory.

Semiconductor is a field that studies the operation of electrons, and the flow of electrons can be explained by the concept of holes, a concept related to the movement of electrons and the lack of electrons at the same time.

Hole refers to electron deprivation, which is caused by the movement of an electron from an atom to which it is bonded.

This indicates a lack of electrons in the bonded atoms.

These holes have a positive charge, as opposed to electrons, and affect electrical behavior.

Hole plays an important role in semiconductor device design.

In particular, in a P-type semiconductor device, the movement of holes and the movement of electrons occur together.

These holes serve to facilitate the movement of current in P-type semiconductor devices.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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