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HOLE Datasheet, PDF

Searched Keyword : 'HOLE' - Total: 242 (7/13) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0015477626 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 26 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0015477652 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 52 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0015477642 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 42 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0015800645 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0015477734 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0015800465 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0015800603 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0015800149 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
0015800445 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
0015477718 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0015800425 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0015800725 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0015800329 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
0015477706 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0015477712 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0015800289 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
0015800703 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38關m (15關) Gold (Au) Selective Plating,
0015477620 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0015800085 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0015800503 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating

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What is HOLE


Hole is one of the concepts used in semiconductor theory.

Semiconductor is a field that studies the operation of electrons, and the flow of electrons can be explained by the concept of holes, a concept related to the movement of electrons and the lack of electrons at the same time.

Hole refers to electron deprivation, which is caused by the movement of an electron from an atom to which it is bonded.

This indicates a lack of electrons in the bonded atoms.

These holes have a positive charge, as opposed to electrons, and affect electrical behavior.

Hole plays an important role in semiconductor device design.

In particular, in a P-type semiconductor device, the movement of holes and the movement of electrons occur together.

These holes serve to facilitate the movement of current in P-type semiconductor devices.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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