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HOLE Datasheet, PDF

Searched Keyword : 'HOLE' - Total: 645 (7/33) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0855055113 Datasheet pdf image
144Kb/3P
Modular Jack, Right Angle, Low Profile, Fully Shielded, 8/8, Cat5e, Through Hole, Version A, Tube
0876201001 Datasheet pdf image
162Kb/4P
1.27mm (.050) Pitch SCA-2 Receptacle, Through Hole, Right Angle, Extended Height, Reverse D Mate, Leadfree
0850039017 Datasheet pdf image
68Kb/3P
2.54mm (.100") Pitch DIN 41612 C/2 Style Male Header, Right Angle, Through Hole, 48 Circuits
0876842001 Datasheet pdf image
161Kb/4P
6.35mm (.250) Pitch EXTreme PowerPlus??Header, All Power, Through Hole, Right Angle, 2 Circuits, Lead-free
0780610062 Datasheet pdf image
373Kb/7P
1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76u (30u") Gold(Au) Selective Plating
0850030218 Datasheet pdf image
83Kb/3P
2.54mm (.100") Pitch DIN 41612 Header, Style C, Vertical, Through Hole, 0.6um (24u") Selective Gold (Au)
0850133304 Datasheet pdf image
79Kb/3P
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1um (40u") Selective Gold (Au)
0780610012 Datasheet pdf image
373Kb/7P
1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76um (30u") Gold(Au) Selective Plating
0855055002 Datasheet pdf image
121Kb/3P
Modular Jack, Right Angle, Low Profile, Shielded, 8/8, Cat5e, Through Hole, Version A, Tape and Reel
0877582617 Datasheet pdf image
182Kb/4P
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 26 Circuits, 0.76um (30u") Gold (Au) Selective Plating
0877580217 Datasheet pdf image
182Kb/4P
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 2 Circuits, 0.76um (30u") Gold (Au) Selective Plating
0877582216 Datasheet pdf image
182Kb/4P
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 22 Circuits, 0.38um (15u") Gold (Au) Selective Plating
0780410002 Datasheet pdf image
149Kb/4P
6.35mm (.250") Pitch, EXTreme PowerPlus??Header, All Power, Through Hole, Vertical, 3 Circuits, with Peg, Lead-free
0877581616 Datasheet pdf image
182Kb/4P
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 16 Circuits, 0.38um (15u") Gold (Au) Selective Plating
0877583450 Datasheet pdf image
147Kb/4P
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 34 Circuits, 0.38um (15u") Gold (Au) Selective Plating
0877580850 Datasheet pdf image
147Kb/4P
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 8 Circuits, 0.38um (15u") Gold (Au) Selective Plating
0877581450 Datasheet pdf image
147Kb/4P
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 14 Circuits, 0.38um (15u") Gold (Au) Selective Plating
0877584417 Datasheet pdf image
182Kb/4P
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 44 Circuits, 0.76um (30u") Gold (Au) Selective Plating
0850130036 Datasheet pdf image
140Kb/5P
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse,0.6um (24u") Selective Gold (Au)
0850030050 Datasheet pdf image
83Kb/3P
2.54mm (.100") Pitch DIN 41612 Header, Style C/2 , Right Angle, Through Hole, 0.6um (24u") Selective Gold (Au)

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What is HOLE


Hole is one of the concepts used in semiconductor theory.

Semiconductor is a field that studies the operation of electrons, and the flow of electrons can be explained by the concept of holes, a concept related to the movement of electrons and the lack of electrons at the same time.

Hole refers to electron deprivation, which is caused by the movement of an electron from an atom to which it is bonded.

This indicates a lack of electrons in the bonded atoms.

These holes have a positive charge, as opposed to electrons, and affect electrical behavior.

Hole plays an important role in semiconductor device design.

In particular, in a P-type semiconductor device, the movement of holes and the movement of electrons occur together.

These holes serve to facilitate the movement of current in P-type semiconductor devices.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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