LAND Datasheet(PDF) - LPN5845 - ABCO ELECTRONICS CO.LTD

Manufacturer	Part #	Datasheet	Description
ABCO ELECTRONICS CO.LTD	LPN5845	100Kb/1P	Shape & Dimensions / Recommended Solder Land Pattern
Maxim Integrated Produc...	90-0021	29Kb/1P	PACKAGE LAND PATTERN, (T2444-3 / T2444+3) Rev B
	90-0032	34Kb/1P	PACKAGE LAND PATTERN, (T1633-5 / T1633+5) Rev B
	90-0150	24Kb/1P	PACKAGE LAND PATTERN, (S8E-12 / S8E+12) Rev A
	90-0179	23Kb/1P	PACKAGE LAND PATTERN, (U3) SOT23, 3 LEADS Rev C
	90-0397	27Kb/1P	PACKAGE LAND PATTERN, 12L TDFN, 3*3 Rev C
	90-0082	23Kb/1P	PACKAGE LAND PATTERN, (T1032N-1 / T1032N+1) Rev B
	90-0119	25Kb/1P	PACKAGE LAND PATTERN, (U14E-3 / U14E+3) Rev C
	90-0339	29Kb/1P	PACKAGE LAND PATTERN, (V1233N-1 / V1233N+1) Rev A
	90-0002	26Kb/1P	PACKAGE LAND PATTERN, (T4055-2 / T4055+2) Rev B
	90-0059	23Kb/1P	PACKAGE LAND PATTERN, (T833-2 / T833+2) Rev B
	90-0121	28Kb/1P	PACKAGE LAND PATTERN, (T1655-4 / T1655+4) Rev B
	90-0022	29Kb/1P	PACKAGE LAND PATTERN, (T2444-4 / T2444+4) Rev B
	90-0058	28Kb/1P	PACKAGE LAND PATTERN, (T633-2 / T633+2) Rev B
	90-0120	26Kb/1P	PACKAGE LAND PATTERN, (U16E-3 / U16E+3) Rev C
	90-0129	23Kb/1P	PACKAGE LAND PATTERN, (T4877-3 / T4877+3) Rev B
STATS ChipPAC, Ltd.	FLGA-SD	537Kb/2P	Fine Pitch Land Grid Array - Stacked Die
Ironwood Electronics.	LS-BGA169M-05	109Kb/1P	169 position SMT land pattern to terminal pins
Maxim Integrated Produc...	90-0097	30Kb/1P	PACKAGE LAND PATTERN, (S16) 0.150 SOIC, 16 LEADS Rev A
Maxim Integrated Produc...	90-0167	25Kb/1P	PACKAGE LAND PATTERN, (E16) 0.150 QSOP, 16 LEADS Rev A

LAND Datasheet, PDF