LEAD-FREE Datasheet(PDF) - NCSR119B-V1 - NICHIA CORPORATION

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LEAD-FREE Datasheet, PDF

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Searched Keyword : 'LEAD-FREE' - Total: 19 (1/1) Pages

Manufacturer	Part #	Datasheet	Description
NICHIA CORPORATION	NCSR119B-V1	434Kb/18P	Pb-free Reflow Soldering Application
	NFSL172A	450Kb/17P	Pb-free Reflow Soldering Application
	NTSL757G	658Kb/25P	Pb-free Reflow Soldering Application
	NVSA219B-V1	444Kb/18P	Pb-free Reflow Soldering Application
	NSSMV01A	545Kb/17P	Pb-free Reflow Soldering Application
	NSSM032A	535Kb/17P	Pb-free Reflow Soldering Application
	NTSW757G	591Kb/23P	Pb-free Reflow Soldering Application
	NCSR119	324Kb/18P	Pb-free Reflow Soldering Application
	NVSA119B-V1	443Kb/18P	Pb-free Reflow Soldering Application
	NCSR219B-V1	434Kb/18P	Pb-free Reflow Soldering Application
	NFSL757DT	319Kb/20P	Pb-free Reflow Soldering Application, Built-in ESD Protection Device
	NFSW757DT	339Kb/22P	Pb-free Reflow Soldering Application, Built-in ESD Protection Device
	NF2L757DRT	319Kb/20P	Pb-free Reflow Soldering Application, Built-in ESD Protection Device
	NVSW219BT	354Kb/21P	Pb-free Reflow Soldering Application, Built-in ESD Protection Device
	NF2W757DRT	339Kb/22P	Pb-free Reflow Soldering Application, Built-in ESD Protection Device
	NSSW157BT	270Kb/17P	Pb-free Reflow Soldering Application, Built-in ESD Protection Device
	NVSL119BT	339Kb/20P	Pb-free Reflow Soldering Application, Built-in ESD Protection Device
	NVSL219BT	337Kb/20P	Pb-free Reflow Soldering Application, Built-in ESD Protection Device
	NVSW119BT	355Kb/21P	Pb-free Reflow Soldering Application, Built-in ESD Protection Device

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What is LEAD-FREE

Lead-free refers to a method of manufacturing products using metals other than lead used in electronic component manufacturing.

It is environmentally friendly and has the advantage of avoiding the use of lead, which is harmful to human health.

In the past, lead was widely used in the manufacture of electronic components, but as lead was found to be harmful to human health, the use of lead-containing products was banned.

As a result, electronic component manufacturing has shifted to making products using other metals instead of lead.

Lead-free electronic component manufacturing methods mainly use metals such as tinner, copper, silver, and gold.

Because these metals melt at a higher temperature than lead, there are challenges such as higher temperatures during manufacturing.

However, these problems have been overcome with the latest technology and manufacturing methods, and lead-free electronic component manufacturing methods are becoming increasingly popular.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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