Manufacturer | Part # | Datasheet | Description |
NXP Semiconductors
|
SOT353 |
13Kb/1P |
Plastic surface-mounted package; 5 leads 21 March 2006 |
SOT143B |
9Kb/1P |
Plastic surface mounted package; 4 leads 29 November 2004 |
SOT343N |
13Kb/1P |
Plastic surface mounted package; 4 leads 1999 Apr 16 |
SOT117-1 |
9Kb/1P |
DIP28: plastic dual in-line package; 28 leads (600 mil) 2003 Feb 18 |
SOT108-1 |
10Kb/1P |
SO14: plastic small outline package; 14 leads; body width 3.9 mm 2003 Mar 24 |
SOT340-1 |
11Kb/1P |
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm 2003 Mar 24 |
SOT765-1 |
13Kb/1P |
plastic very thin shrink small outline package; 8 leads; body width 2.3 mm 2002 Jun 07 |
SOT545-3 |
15Kb/1P |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad 2004 Feb 05 |