Manufacturer | Part # | Datasheet | Description |
Maxim Integrated Produc...
|
90-0179 |
23Kb/1P |
PACKAGE LAND PATTERN, (U3) SOT23, 3 LEADS Rev C |
90-0107 |
28Kb/1P |
PACKAGE LAND PATTERN, (216) 0.300 SOIC, 16 LEADS Rev D |
90-0096 |
28Kb/1P |
PACKAGE LAND PATTERN, (S8) 0.150 SOIC, 8 LEADS Rev C |
90-0117 |
29Kb/1P |
PACKAGE LAND PATTERN, (U16) 4.4MM TSSOP, 16 LEADS Rev C |
90-0097 |
30Kb/1P |
PACKAGE LAND PATTERN, (S16) 0.150 SOIC, 16 LEADS Rev A |
90-0167 |
25Kb/1P |
PACKAGE LAND PATTERN, (E16) 0.150 QSOP, 16 LEADS Rev A |
90-0112 |
29Kb/1P |
PACKAGE LAND PATTERN, 9S14) .150 SOIC 14 LEADS Rev B |
90-0330 |
23Kb/1P |
PACKAGE LAND PATTERN, (U10) 3*3MM UMAX, 10 LEADS Rev B |
90-0114 |
26Kb/1P |
PACKAGE LAND PATTERN, (U20E-1 / U20E+1) TSSOP 20 LEADS Rev B |
21-0576 |
56Kb/2P |
PACKAGE OUTLINE, 20L 4*4*0.85MM QFN PKG, WITH DIMPLE LEADS REV .A |