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LEAD-FREE Datasheet, PDF

ALL 3M Electronics(4)A-BRIGHT Inc(53)Abracon Corporation(5)Actel Corporation(26)Advanced Power Electronics Corp.(48)Advanced Semiconductor(4)Advantech Co., Ltd.(1)Agilent(Hewlett-Packard)(9)AiT Semiconductor Inc.(1)Allegro MicroSystems(1)Alpha & Omega Semiconductors(36)ALPS ELECTRIC CO.,LTD.(1)AMAZING Microelectronic Corp.(3)Amkor Technology(1)Amphenol Corporation(4)Analog Devices(248)Analog Microelectronics(1)Anaren Microwave(1)Anova Technologies CO., LTD.(17)Anpec Electronics Coropration(13)API Delevan(7)API Technologies Corp(3)Arch Electronics Corp.(2)Aries Electronics, Inc.(1)Artesyn Technologies(1)Asahi Kasei Microsystems(2)Assmann Electronics Inc.(10)Astec America, Inc(6)Astrodyne Corporation(1)ATMEL Corporation(3)AVAGO TECHNOLOGIES LIMITED(36)AVX Corporation(10)Axiomtek Co., Ltd.(1)B. B. Battery Co., Ltd.(49)Bel Fuse Inc.(27)Belden Inc.(104)Bothhand USA, LP.(13)Bourns Electronic Solutions(23)BRIGHT LED ELECTRONICS CORP(28)Broadcom Corporation.(6)C&B ELECTRONICS (SHENZHEN) CO., LTD(8)C&D Technologies(4)Caddock Electronics, Inc.(4)California Eastern Labs(23)Calogic, LLC(1)CAMBION Electronic Components(16)Central Semiconductor Corp(2)Champion Microelectronic Corp.(1)Chicago Miniature Lamp,inc(2)Chip Integration Technology Corporation(4)Clairex Technologies, Inc(4)CML Microcircuits(5)Coilcraft lnc.(3)Comchip Technology(5)Continental Device India Limited(6)Cooper Bussmann, Inc.(3)Core Technology (Shenzhen) Co., Ltd.(1)Cornell Dubilier Electronics(16)COSMO Electronics Corporation(24)CSB Battery Co., Ltd.(93)CUI INC(2)Cynergy3 Co(2)Cyntec Co., Ltd.(106)Cypress Semiconductor(1)Cystech Electonics Corp.(1)DAESAN ELECTRONIC CORP.(10)Datatronic Distribution, Inc.(1)DB Lectro Inc(3)Delta Electronics, Inc.(23)Dialog Semiconductor(2)Dielectric Laboratories, Inc.(2)Digitron Semiconductors(1)DinTek Semiconductor Co,.Ltd(82)Diodes Incorporated(11)DIOTEC Electronics Corporation(4)DIYI Electronic Technology Co., Ltd.(3)DONGGUAN YOU FENG WEI ELECTRONICS CO., LTD(1)Dubilier(1)E-SWITCH(1)E-Tech Electronics LTD(7)Eaton All Rights Reserved.(9)ECS, Inc.(8)EHAOAN.(1)Electronic devices inc.(6)Elite Semiconductor Memory Technology Inc.(1)Elpida Memory(1)Endress+Hauser Group Services AG(1)Energizer(1)Ensign Corporation(2)EPCOS(10)Epson Company(1)Estek Electronics Co. Ltd(2)ETAL Group(1)Eudyna Devices Inc(6)Eutech Microelectronics Inc(1)Everlight Electronics Co., Ltd(47)Extech Instruments Corporation.(11)
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Searched Keyword : 'Lead-Free' - Total: 21 (1/2) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Samsung semiconductor
K4B2G1646F Datasheet pdf image
515Kb/71P
96FBGA with Lead-Free & Halogen-Free
K4S281632O-LC75000 Datasheet pdf image
434Kb/18P
54TSOP(II) with Lead-Free & Halogen-Free (RoHS compliant)
K4T1G164QE-HCE7000 Datasheet pdf image
1Mb/46P
1Gb E-die DDR2 SDRAM 60FBGA/84FBGA with Lead-Free & Halogen-Free (RoHS compliant)
K4T1G164QF-BCE6000 Datasheet pdf image
1Mb/46P
1Gb F-die DDR2 SDRAM 60FBGA/84FBGA with Lead-Free & Halogen-Free (RoHS compliant)
K4B2G1646C-HCF8000 Datasheet pdf image
1Mb/64P
2Gb C-die DDR3 SDRAM Only x16 96FBGA with Lead-Free & Halogen-Free (RoHS compliant)
K4B4G1646Q Datasheet pdf image
522Kb/65P
4Gb Q-die DDR3L SDRAM Olny x16 96FBGA with Lead-Free & Halogen-Free (RoHS compliant) 1.35V
K4S640432H-TC Datasheet pdf image
144Kb/14P
64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free
K7A163631B Datasheet pdf image
373Kb/19P
18MB B-DIE SYNC SRAM SPECIFICATION 100TQFP WITH PB, PB-FREE
K4S280432F-UC Datasheet pdf image
145Kb/14P
128Mb F-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant)
K4H560438E-ZC Datasheet pdf image
359Kb/23P
256Mb E-die DDR SDRAM Specification 60 FBGA with Pb-Free (RoHS compliant)
K4S640432H-UC Datasheet pdf image
144Kb/14P
64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant)
K4S560432E-UC Datasheet pdf image
198Kb/14P
256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant)
K4H560438E-UC Datasheet pdf image
297Kb/23P
256Mb E-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)
K4H280438F-UC Datasheet pdf image
298Kb/23P
128Mb F-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)
K4H560438E-VC Datasheet pdf image
297Kb/23P
256Mb E-die DDR SDRAM Specification 54 sTSOP-II with Pb-Free (RoHS compliant)
K7I643682M Datasheet pdf image
309Kb/17P
72Mb M-die DDRII SRAM Specification 165 FBGA with Pb & Pb-Free (RoHS compliant)
K4H511638D Datasheet pdf image
366Kb/24P
512Mb D-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)
K4H1G0438M-UC Datasheet pdf image
206Kb/23P
1Gb M-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)
RC2012F510CS Datasheet pdf image
791Kb/2P
Owing to the reduced lead inductance, the high frequency characteristic is excellent.
M470L3324DU0 Datasheet pdf image
284Kb/20P
DDR SDRAM Unbuffered Module 18 4 pin Unbuffered Module based on 512Mb D-die 66 TSOP-II & 54 sTSOP-II with Pb-Free (RoHS compliant)

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What is Lead-Free


Lead-free refers to a method of manufacturing products using metals other than lead used in electronic component manufacturing.

It is environmentally friendly and has the advantage of avoiding the use of lead, which is harmful to human health.

In the past, lead was widely used in the manufacture of electronic components, but as lead was found to be harmful to human health, the use of lead-containing products was banned.

As a result, electronic component manufacturing has shifted to making products using other metals instead of lead.

Lead-free electronic component manufacturing methods mainly use metals such as tinner, copper, silver, and gold.

Because these metals melt at a higher temperature than lead, there are challenges such as higher temperatures during manufacturing.

However, these problems have been overcome with the latest technology and manufacturing methods, and lead-free electronic component manufacturing methods are becoming increasingly popular.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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