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LEAD-FREE Datasheet, PDF

P-tec Corporation(39)Pan Jit International Inc.(11)Panasonic Battery Group(24)Panasonic Semiconductor(55)PANDUIT CORP.(3)Pasternack Enterprises, Inc.(685)PCA ELECTRONICS INC.(1)Pentair plc. All rights reserved.(2)Peregrine Semiconductor Corp.(1)Pericom Semiconductor Corporation(2)PHOENIX CONTACT(58)Pixart Imaging Inc.(4)Pletronics, Inc.(3)Pomona Electronics(41)Power Integrations, Inc.(1)Power Sonic Corporation(204)Power-One(1)Powerex Power Semiconductors(12)Precid-Dip Durtal SA(1)Projects Unlimited, Inc.(5)PUI audio inc.(3)Qorvo, Inc(2)QUARTZCOM the communications company(2)Quelighting Corp(3)RAF ELECTRONIC HARDWARE(1)Raltron Electronics Corporation(4)RCD COMPONENTS INC.(7)Rectron Semiconductor(2)Renesas Technology Corp(39)RF Micro Devices(2)RFE international(1)RFX Ltd.(9)Rhombus Industries Inc.(4)Richtek Technology Corporation(1)Rochester Electronics(2)Rohm(36)Roithner LaserTechnik GmbH(19)Rosenberger Hochfrequenztechnik GmbH & Co. KG(1)RUBYCON CORPORATION(313)Sames(1)Samsung semiconductor(21)Samtec, Inc(9)Sangdest Microelectronic (Nanjing) Co., Ltd(23)Sanken electric(8)SanRex Corporation(1)Sanyo Semicon Device(4)Schneider Electric(27)Schurter Inc.(7)Seiko Instruments Inc(5)Seme LAB(2)Semikron International(7)Semtech Corporation(1)Sensitron(20)Seoul Semiconductor(19)Shanghai awinic technology co.,ltd(1)Shanghai Consonance Electronics Incorporated(3)Shanghai Leiditech Electronic Technology Co., Ltd(43)Shanghai Lunsure Electronic Tech(1)Shanghai Semitech Semiconductor Co., Ltd(1)Shanghai Shunye Electronics Co.,Ltd.(7)Sharp Corporation(1)SHENZHEN FUMAN ELECTRONICS CO., LTD.(1)Shenzhen Huazhimei Semiconductor Co., Ltd(9)Shenzhen Luguang Electronic Technology Co., Ltd(8)Shenzhenshi YONGFUKANG Technology co.,LTD(2)SHIELD s.r.l.(5)Siemens Semiconductor Group(77)SIFIRST TECHNOLOGIES NANHAI LIMITED(1)Silicon Laboratories(3)Silver Telecom 2019(2)SiPower Inc.(2)Sirectifier Semiconductors(4)Skyworks Solutions Inc.(18)SL Power Electronics(2)SMSC Corporation(2)Socay Electornics Co., Ltd.(39)SparkFun Electronics(1)STANLEY ELECTRIC CO.,LTD.(74)STATS ChipPAC, Ltd.(1)STI Vibration Monitoring Inc.(2)STMicroelectronics(38)Sumida Corporation(3)SUNMATE electronic Co., LTD(4)Suntan Capacitors(1)Suntsu Electronics, Inc.(4)Surge Components(5)SUYIN USA, INC.(1)Suzhou Maswell Communication Technology Co. Ltd(1)SYNERGY MICROWAVE CORPORATION(1)TAI-TECH Advanced Electronics Co., Ltd.(49)Taiwan Semiconductor Company, Ltd(8)Tak Cheong Electronics (Holdings) Co.,Ltd(47)Taoglas antenna solutions(3)TDK Electronics(1404)TE Connectivity Ltd(28)TECHCODE SEMICONDUCTOR, INC.(2)Telit loT Solutions(1)TEMEX(2)TEMIC Semiconductors(2)Texas Instruments(82)Texas Instruments(63)Thinki Semiconductor Co., Ltd.(7)Thinking Electronic Industrial Co.,Ltd(1)TOKO, Inc(1)TOKYO SEIMITSU CO., LTD(1)Toshiba Semiconductor(16)Total Power International(2)TRANSYS Electronics Limited(2)Tripp Lite. All Rights Reserved(2)TriQuint Semiconductor(13)TT Electronics.(7)Tyco Electronics(33)
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Searched Keyword : 'Lead-Free' - Total: 38 (1/2) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
STMicroelectronics
ESDA6V1-5T6 Datasheet pdf image
172Kb/11P
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AN2639 Datasheet pdf image
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Soldering recommendations and package information for Lead-free ECOPACK microcontrollers
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561Kb/32P
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1Mb/22P
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Filter-free stereo 2x2.8W class D audio power amplifer
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2.8W filter-free mono class D audio power amplifier
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What is Lead-Free


Lead-free refers to a method of manufacturing products using metals other than lead used in electronic component manufacturing.

It is environmentally friendly and has the advantage of avoiding the use of lead, which is harmful to human health.

In the past, lead was widely used in the manufacture of electronic components, but as lead was found to be harmful to human health, the use of lead-containing products was banned.

As a result, electronic component manufacturing has shifted to making products using other metals instead of lead.

Lead-free electronic component manufacturing methods mainly use metals such as tinner, copper, silver, and gold.

Because these metals melt at a higher temperature than lead, there are challenges such as higher temperatures during manufacturing.

However, these problems have been overcome with the latest technology and manufacturing methods, and lead-free electronic component manufacturing methods are becoming increasingly popular.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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