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MINIMUM Datasheet, PDF

Search Description : 'MINIMUM' - Total: 360 (1/18) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

Molex Electronics Ltd.
0759001322 3.50mm (.138") Pitch, MX150™ Dual Row Header, Breakaway, Right Angle, 2 Circuits1.25μm (50μ") Nickel (Ni) Overall, 2.50μm (100μ") Minimum Select Matte Tin (Sn)Plating on Tail, 0.75μm Minimum Select Gold (Au) Contact Area, 4.75mm (.187") PC
0759001301 3.50mm (.138") Pitch, MX150™ Dual Row Header, Breakaway, Right Angle, 20Circuits, 1.25μm (50μ") Nickel (Ni) Overall, 2.50μm (100μ") Minimum Select Matte TinSn) Plating on Tail, 0.75μm Minimum Select Gold (Au) Contact Area, 3.05mm (.120")
0759001281 3.50mm (.138") Pitch, MX150™ Dual Row Header, Breakaway, Right Angle, 16Circuits, 1.25μm (50μ") Nickel (Ni) Overall, 2.50μm (100μ") Minimum Select Matte Tin(Sn) Plating on Tail, 0.05μm Minimum Select Gold (Au) Contact Area, 3.05mm (.120")
0757570232 3.50mm (.138") Pitch, MX150™ Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ")Nickel (Ni) Overall, 2.50μm (100μ") Minimum Select Matte Tin (Sn) Plating on Tail0.05μm Minimum Select Gold (Au) Contact Area, 11.20mm (.440") Mating Pin
0713085414 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
0713085470 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 70 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
0713086422 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 22 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130")

ATMEL Corporation
AT25DF021 2-Megabit 2.3-volt or 2.7-volt Minimum SPI Serial Flash Memory

Ironwood Electronics.
SS-BGA420D-01 Minimum real estate required

Taiyo Yuden (U.S.A.), I...
QVS107CG0R8BCHT Standard packaging quantity (minimum) Taping paper 4000pcs

List of Unclassifed Man...
AT25DF641A 64-Mbit, 2.7V Minimum SPI Serial Flash Memory with Dual.I/O Support

Molex Electronics Ltd.
0757575281 3.50mm (.138) Pitch, MX150™ Header, Breakaway, Vertical, 16 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
0713086450 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 50 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130")

GTM CORPORATION
GL1147 a low dropout at positive fixed-mode regulator with minimum of 1A output current capability.

Pentair plc. All rights...
2900S A minimum of 20 pounds (1.4 bar) of water pressure is required for regeneration valve to operate effectively

Molex Electronics Ltd.
0757570251 3.50mm (.138") Pitch, MX150™ Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ")Nickel (Ni) Overall, 2.50μm (100μ") Minimum Select Matte Tin (Sn) Plating on Tail
0713085438 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 38 Circuits, 1.50μm (59u") Minimum
0713086416 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 16 Circuits, 1.50um (59u") Minimum
0713086440 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 40 Circuits1.50μm (59μ") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130

NEC
LD7246A 14 GHz, 123 W CW, CONDUCTION COOLING, MINIMUM SIZE

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