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PACKAGE Datasheet, PDF

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Searched Keyword : 'PACKAGE' - Total: 3 (1/1) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
RICOH electronics devic...
RQ5RW Datasheet pdf image
173Kb/23P
SMALL PACKAGE VOLTAGE REGULATOR
R1100D Datasheet pdf image
267Kb/14P
ULTRA SMALL PACKAGE VOLTAGE REGULATOR
R1100D Datasheet pdf image
327Kb/16P
ULTRA SMALL PACKAGE VOLTAGE REGULATOR

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What is PACKAGE


In electronic parts, PACKAGE means a case or package used to protect and connect devices.

PACKAGE plays an important role in protecting and connecting devices.

If the device is not properly protected, environmental influences can damage or destroy the device.

PACKAGE comes in various shapes and sizes, and there are various types depending on the type and purpose of the device.

Representative packages include DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), and BGA (Ball grid array).

A DIP is one of the more representative packages and has two pins placed in-line.

SOPs are smaller packages than DIPs and have a rectangular shape.

QFP is a package with pins parallel to the circumference of the package, and BGA is a package in which small holes are drilled in the bottom of the elements and small beads are attached to them to connect the elements.

Depending on the characteristics of each package, it is used for various purposes.

For example, DIPs are generally used for low-density integrated circuits, and BGAs are used for high-density integrated circuits.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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