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PACKAGE Datasheet, PDF

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Searched Keyword : 'PACKAGE' - Total: 17 (1/1) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Alliance Semiconductor ... 		AS4C32M16SB-7TIN Datasheet pdf image
1Mb/55P		 54pin TSOPII PACKAGE
AS4C32M16SB-7TINTR Datasheet pdf image
1Mb/55P		 54pin TSOPII PACKAGE
AS4C64M16D3A-12BAN Datasheet pdf image
1Mb/86P		 96 ball FBGA PACKAGE
AS4C128M16D3LA-12BIN Datasheet pdf image
2Mb/83P		 96 ball FBGA PACKAGE
AS4C8M16D1-5BIN Datasheet pdf image
4Mb/66P		 60-ball FBGA PACKAGE
AS4C512M8D3A-12BCN Datasheet pdf image
1Mb/83P		 78 ball FBGA PACKAGE
AS4C64M16D3A Datasheet pdf image
1Mb/86P		 96 ball FBGA PACKAGE
AS4C32M16MD1A Datasheet pdf image
2Mb/53P		 60 ball FBGA PACKAGE
AS4C16M16D1A Datasheet pdf image
2Mb/64P		 66-pin TSOPII PACKAGE
AS4C128M16D3LB Datasheet pdf image
3Mb/45P		 96 ball FBGA PACKAGE
AS4C128M8D3L Datasheet pdf image
3Mb/88P		 AS4C128M8D3L - 78-ball FBGA PACKAGE
AS4C256M16D3B Datasheet pdf image
2Mb/41P		 12BCN 96 ball FBGA PACKAGE
AS4C512M8D3L Datasheet pdf image
3Mb/86P		 AS4C512M8D3L - 78-ball FBGA PACKAGE
AS4C128M16D3A Datasheet pdf image
2Mb/83P		 AS4C128M16D3A-12BIN - 96 ball FBGA PACKAGE
AS4C2M32SA Datasheet pdf image
5Mb/54P		 64Mb SDRAM AS4C2M32SA - 86pin TSOP II PACKAGE
AS4C128M16D3B Datasheet pdf image
1Mb/41P		 2Gb AS4C128M16D3B-12BCN - 96 ball FBGA PACKAGE
AS4C4M32SA-7TCN Datasheet pdf image
1Mb/47P		 4M x 32bit -AS4C4M32SA - 86-pin TSOP II PACKAGE

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What is PACKAGE

In electronic parts, PACKAGE means a case or package used to protect and connect devices.

PACKAGE plays an important role in protecting and connecting devices.

If the device is not properly protected, environmental influences can damage or destroy the device.

PACKAGE comes in various shapes and sizes, and there are various types depending on the type and purpose of the device.

Representative packages include DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), and BGA (Ball grid array).

A DIP is one of the more representative packages and has two pins placed in-line.

SOPs are smaller packages than DIPs and have a rectangular shape.

QFP is a package with pins parallel to the circumference of the package, and BGA is a package in which small holes are drilled in the bottom of the elements and small beads are attached to them to connect the elements.

Depending on the characteristics of each package, it is used for various purposes.

For example, DIPs are generally used for low-density integrated circuits, and BGAs are used for high-density integrated circuits.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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